EP4CE115F23C7

IC FPGA 280 I/O 484FBGA
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 280 3981312 114480 484-BGA

Quantity 984 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O280Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7155Number of Logic Elements/Cells114480
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3981312

Overview of EP4CE115F23C7 – Cyclone IV E FPGA, 114,480 logic elements, 484-BGA

The EP4CE115F23C7 is a Cyclone® IV E field programmable gate array (FPGA) in a 484-ball FBG A package targeted at commercial applications. It provides 114,480 logic elements and approximately 3.98 Mbits of embedded memory, with 280 user I/O pins for system interfacing.

This device operates from a 1.15 V to 1.25 V core supply and is specified for commercial temperature operation from 0 °C to 85 °C. It is supplied in a surface-mount 484-FBGA (23 × 23) package and is RoHS compliant.

Key Features

  • Core Logic  114,480 logic elements provide a high-density fabric for complex custom logic and glue circuitry.
  • Embedded Memory  Approximately 3.98 Mbits of on-chip RAM to support buffers, FIFOs, and local storage for processing pipelines.
  • I/O Density  280 user I/O pins enable broad connectivity to external peripherals, memory interfaces, and custom interfaces.
  • Package and Mounting  484-FBGA (23×23) package in a surface-mount form factor for compact, board-level integration.
  • Power Supply  Core voltage operating range from 1.15 V to 1.25 V to match validated power-rail designs.
  • Commercial Grade & Compliance  Commercial temperature grade (0 °C to 85 °C) and RoHS compliant for standard commercial production environments.
  • Documentation  Supported by Cyclone IV device handbook and device datasheet references for electrical, timing, and packaging details.

Typical Applications

  • High‑density logic and prototyping  Use the 114,480 logic elements to implement complex FPGA-based prototypes and custom logic subsystems.
  • Embedded memory buffering  Approximately 3.98 Mbits of embedded RAM is suitable for on-chip data buffering, FIFOs, and small caches.
  • Board-level interface and glue logic  280 I/Os provide the flexibility to implement multiple peripheral interfaces and bridge functions on compact PCBs.
  • Compact surface-mount designs  The 484-FBGA (23×23) package supports dense board layouts where board space and signal routing are critical.

Unique Advantages

  • High logic capacity: 114,480 logic elements deliver substantial programmable resources for complex designs without external ASICs.
  • On‑chip memory availability: Nearly 4 Mbits of embedded RAM reduces dependence on external memory for many buffering and processing tasks.
  • Flexible I/O count: 280 user I/Os enable versatile connectivity options, minimizing the need for extra interface ICs.
  • Standard commercial rating: Specified for 0 °C to 85 °C operation to match mainstream commercial product requirements.
  • RoHS compliant: Meets RoHS requirements for environmentally conscious manufacturing and deployment.
  • Compact package option: 484-FBGA (23×23) surface-mount package helps optimize PCB real estate while supporting high pin counts.

Why Choose EP4CE115F23C7?

The EP4CE115F23C7 Cyclone IV E FPGA combines high logic capacity, substantial embedded RAM, and a large I/O complement in a compact 484-FBGA package, making it well suited for commercial designs that require significant programmable logic integration. Its specified voltage range and commercial temperature rating provide deterministic hardware parameters for design planning and power-rail integration.

This device is appropriate for engineering teams building FPGA-centric systems that need a balance of logic density, on-chip memory, and I/O flexibility, backed by the Cyclone IV device documentation for electrical and packaging details.

Request a quote or submit an inquiry to learn more about availability, lead times, and volume pricing for EP4CE115F23C7.

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