EP4CE15U14I7N
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 165 516096 15408 256-LFBGA |
|---|---|
| Quantity | 474 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-UBGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 165 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 963 | Number of Logic Elements/Cells | 15408 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 516096 |
Overview of EP4CE15U14I7N – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 165 516096 15408 256-LFBGA
The EP4CE15U14I7N is a Cyclone IV E series field programmable gate array (FPGA) in a 256‑LFBGA package. It provides a balance of configurable logic, embedded RAM, and I/O density for applications that require programmable hardware implementation and industrial temperature capability.
Designed for surface-mount board-level integration, this device offers 15,408 logic elements, approximately 0.516 Mbits of on-chip RAM, and 165 general-purpose I/O pins, delivered in a compact 14 × 14 mm UBGA package and specified for industrial operating temperatures.
Key Features
- Core Architecture: Cyclone IV E FPGA family device providing programmable logic resources for custom digital designs.
- Logic Capacity: 15,408 logic elements to implement combinational and sequential logic functions and glue logic.
- Embedded Memory: Approximately 0.516 Mbits of embedded RAM to support buffering, FIFOs, and local storage.
- I/O Density: 165 I/O pins for flexible connectivity to peripherals, sensors, and external interfaces.
- Power Supply: Core supply voltage range 1.15 V to 1.25 V for the device core.
- Package & Mounting: 256‑LFBGA (supplier package 256‑UBGA, 14×14) in a surface-mount form factor for compact board layouts.
- Temperature Grade: Industrial operating range from −40 °C to 100 °C for harsh-environment deployment.
- Environmental Compliance: RoHS compliant.
- Documentation: Supported by the Cyclone IV Device Handbook and device datasheet for electrical, timing, and packaging specifications.
Typical Applications
- Industrial Control: Implement control logic, custom sequencing, or protocol bridging where industrial temperature range and configurable logic are needed.
- Embedded Systems: Provide glue logic, peripheral interfacing, and custom data handling tasks that benefit from on-chip RAM and flexible I/O.
- Prototyping and System Integration: Use as a platform for hardware validation, custom IP development, and integration of digital subsystems on a compact BGA footprint.
Unique Advantages
- Matched to Industrial Environments: Specified for −40 °C to 100 °C operation, enabling deployment in temperature-variable installations.
- Balanced Logic and Memory: 15,408 logic elements combined with approximately 0.516 Mbits of embedded RAM allows implementation of medium-complexity logic with local data storage.
- Significant I/O Count: 165 I/Os support multiple external interfaces and parallel connections without immediate need for external I/O expanders.
- Compact Surface-Mount Package: 256‑LFBGA / 256‑UBGA (14×14) offers a high-density solution for space-constrained PCBs.
- Controlled Core Power Range: Narrow core supply window (1.15 V to 1.25 V) provides defined power requirements for board-level power design.
- Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.
Why Choose EP4CE15U14I7N?
The EP4CE15U14I7N delivers a practical combination of logic density, embedded memory, and I/O capacity in a compact, industrial‑rated FPGA package. It is well suited for designs that require configurable digital logic in environments with extended temperature demands and board-space constraints.
Backed by the Cyclone IV device documentation, this device supports disciplined system-level design with clear electrical and packaging specifications, making it suitable for engineers seeking a dependable, mid-density FPGA for industrial and embedded applications.
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