EP4CE22E22C6
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 79 608256 22320 144-LQFP Exposed Pad |
|---|---|
| Quantity | 214 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 79 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1395 | Number of Logic Elements/Cells | 22320 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 608256 |
Overview of EP4CE22E22C6 – Cyclone® IV E Field Programmable Gate Array (FPGA) IC, 22,320 logic elements
The EP4CE22E22C6 is a Cyclone IV E family Field Programmable Gate Array (FPGA) IC from Intel, offering 22,320 logic elements and on-chip embedded memory. It provides a balance of programmable logic capacity, embedded RAM, and I/O for commercial electronic designs.
Packaged in a 144-LQFP exposed pad (supplier package: 144-EQFP 20×20) and designed for surface-mount assembly, this device targets applications requiring moderate logic density, integrated memory, and a compact footprint while operating within a commercial temperature range.
Key Features
- Logic Capacity 22,320 logic elements for implementing programmable combinational and sequential logic.
- Embedded Memory Approximately 0.61 Mbits of embedded memory (608,256 total RAM bits) for local buffering and state storage.
- I/O 79 general-purpose I/O pins to support multiple peripheral and interface connections.
- Power Supply Core voltage supply range of 1.15 V to 1.25 V for the device core.
- Package & Mounting 144-LQFP exposed pad package in a surface-mount form factor (supplier device package: 144-EQFP, 20×20).
- Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
- Family Documentation Part of the Cyclone IV device family with accompanying Cyclone IV device handbook and datasheet documentation.
Typical Applications
- Embedded control and state machines Use the 22,320 logic elements and embedded memory to implement control logic, finite-state machines, and on-board processing tasks.
- Interface bridging and protocol glue Leverage 79 I/O pins to bridge logic domains, translate signals, and implement board-level interface logic.
- Local buffering and FIFO functions Approximately 0.61 Mbits of on-chip RAM enables localized buffering and small data-store functions without immediate need for external memory.
- Compact system integration The 144-LQFP exposed pad surface-mount package supports integration into space-constrained PCBs and module designs.
Unique Advantages
- Moderate logic density in a compact package: 22,320 logic elements in a 144-LQFP exposed pad form factor reduce board area while providing substantial programmable logic.
- On-chip memory reduces external BOM: Approximately 0.61 Mbits of embedded RAM helps minimize external memory components for small buffering tasks.
- Flexible I/O count: 79 I/O pins enable multiple peripheral connections and board-level interfacing without excessive multiplexing.
- Defined core supply window: A 1.15 V to 1.25 V core voltage range simplifies power-domain planning for the FPGA core.
- Commercial temperature rating: 0 °C to 85 °C operation aligns with a wide range of consumer and enterprise electronic products.
- RoHS compliance: Meets environmental compliance expectations for modern electronics manufacturing.
Why Choose EP4CE22E22C6?
The EP4CE22E22C6 positions itself as a Cyclone IV E FPGA solution that combines a substantial logic element count, embedded RAM, and a practical I/O complement in a compact 144-LQFP exposed pad package. Its commercial-grade temperature range and RoHS compliance make it suitable for a broad set of non-automotive electronic designs that require onboard programmable logic and modest memory resources.
Designed and documented as part of the Cyclone IV family, this device is supported by Cyclone IV device handbook content and datasheet documentation to assist design integration and system planning.
Request a quote or submit an inquiry to obtain pricing and availability for EP4CE22E22C6. Our team can provide lead-time and purchasing details to support your design schedule.

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