EP4CE22E22C6N

The EP4CE22E22C6N is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC from Intel, offered in a 144-LQFP exposed-pad surface-mount package. It provides mid-range programmable logic capacity with on-chip memory and a broad set of I/O for embedded and digital designs.

Designed for commercial-temperature applications, the device combines 22,320 logic elements, approximately 608,256 bits of embedded RAM, and 79 I/Os, operating from a 1.15 V to 1.25 V core supply and rated for 0 °C to 85 °C. Detailed electrical, timing and operating information is documented in the Cyclone IV device handbook and device datasheet.

Key Features

• Logic Capacity — 22,320 logic elements provide mid-density programmable logic resources for custom digital functions and control logic.
• Embedded Memory — Approximately 608,256 bits of on-chip RAM to support buffering, state machines, and small data storage without external memory.
• I/O Count — 79 general-purpose I/Os to interface with peripherals, sensors, and external devices.
• Power and Voltage — Core operating voltage range from 1.15 V to 1.25 V, enabling integration with modern low-voltage systems.
• Package & Mounting — 144-LQFP exposed pad package (supplier device package: 144-EQFP, 20×20); surface-mount mounting simplifies board-level assembly and thermal conduction via the exposed pad.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial applications.
• Regulatory — RoHS compliant.
• Documentation — Supported by the Cyclone IV device handbook and detailed device datasheet covering operating conditions, DC characteristics, switching characteristics, supply currents and I/O specifications.

Typical Applications

• Embedded Control — Implement custom control logic, glue logic and peripheral interfaces where mid-range logic capacity and on-chip RAM are required.
• Prototyping & Development — Use the programmable fabric for hardware prototyping and iterative digital design validation.
• Interface Bridging — Consolidate multiple I/O functions and protocol translation using the available 79 I/Os and embedded memory.

Unique Advantages

• Mid-density Logic in a Compact Footprint: 22,320 logic elements in a 144-LQFP exposed-pad package enable substantial logic integration while preserving board space.
• On-chip Embedded Memory: Approximately 608,256 bits of RAM reduce dependence on external memory for many buffering and small-data tasks.
• Flexible I/O Count: 79 I/Os provide ample connectivity for sensor interfaces, peripherals, and custom I/O groupings.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for reliable operation in commercial-environment designs.
• Surface-mount with Exposed Pad: The exposed pad package supports thermal management and standard SMT assembly processes.
• Documented Specification Set: Detailed device handbook and datasheet material are available for electrical, timing and operating guidance.

Why Choose EP4CE22E22C6N?

The EP4CE22E22C6N positions itself as a practical Cyclone IV E FPGA option for designers needing mid-range programmable logic, on-chip memory, and a substantial I/O count in a compact surface-mount package. Its commercial temperature rating and RoHS compliance make it suitable for standard embedded, interface and prototyping applications.

Backed by Intel’s Cyclone IV documentation, the device provides a documented specification set for system-level design decisions, enabling predictable integration and streamlined development cycles for projects that match its logic, memory, and I/O profile.

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