EP4CE22E22C8L
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 79 608256 22320 144-LQFP Exposed Pad |
|---|---|
| Quantity | 588 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 79 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1395 | Number of Logic Elements/Cells | 22320 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 608256 |
Overview of EP4CE22E22C8L – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 79 608256 22320 144-LQFP Exposed Pad
The EP4CE22E22C8L is a Cyclone IV E field programmable gate array (FPGA) supplied by Intel. It provides a mid-range programmable logic fabric packaged in a 144-LQFP exposed pad surface-mount package for commercial-grade designs.
Key on-chip resources include 22,320 logic elements, approximately 0.608 Mbits of embedded memory, and 79 user I/O pins. The device operates from a core supply range of 0.970 V to 1.03 V and is specified for commercial temperatures from 0 °C to 85 °C. The product is RoHS compliant.
Key Features
- FPGA Core 22,320 logic elements provide a flexible, programmable fabric for custom digital logic and glue logic integration.
- Embedded Memory Approximately 0.608 Mbits of on-chip RAM to support buffering, state storage, and small data structures within designs.
- I/O Resources 79 user I/O pins for interfacing to external peripherals, sensors, and interfaces in a compact package.
- Power Core supply nominal range of 0.970 V to 1.03 V to match system power rails and enable predictable core operation.
- Package & Mounting 144-LQFP exposed pad (supplier device package: 144-EQFP 20×20) in a surface-mount form factor suitable for compact PCB layouts and thermal conduction through the exposed pad.
- Operating Range & Grade Commercial grade specification with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant, supporting lead-free manufacturing and regulatory requirements.
Typical Applications
- Commercial Embedded Systems Use the device’s 22,320 logic elements and 79 I/Os to implement control, interface, and integration tasks in commercial electronic products.
- Prototyping and Development Leverage the Cyclone IV E programmable fabric and on-chip RAM for hardware prototyping, proof-of-concept designs, and iterative development.
- Custom Logic and Glue Implement custom protocol bridging, timing control, and peripheral aggregation where a compact surface-mount package and exposed pad thermal path are advantageous.
Unique Advantages
- Significant Logic Capacity: 22,320 logic elements enable substantial programmable logic integration without moving to larger families.
- Integrated On-Chip RAM: Approximately 0.608 Mbits of embedded memory reduces the need for external RAM for small buffering and state storage tasks.
- Compact, Thermally-Aware Package: 144-LQFP with an exposed pad supports surface-mount assembly and provides a thermal path for stable operation on dense PCBs.
- Predictable Power Window: A defined core supply range (0.970 V–1.03 V) simplifies power-supply planning and integration with system rails.
- Commercial Temperature Rating: Specified for 0 °C to 85 °C operation to match mainstream commercial electronic products and environments.
- RoHS Compliant: Supports lead-free assembly processes and environmental compliance requirements.
Why Choose EP4CE22E22C8L?
The EP4CE22E22C8L positions itself as a commercially graded Cyclone IV E FPGA option that balances programmable logic capacity, embedded memory, and I/O density in a compact 144-LQFP exposed pad package. Its clearly defined core voltage range and operating temperature make it suitable for mainstream commercial designs where predictable electrical and thermal behavior matter.
This device is well suited to engineers looking for a fixed-feature, programmable logic solution with on-chip RAM and a practical I/O count for control, interface, or prototyping tasks. The combination of logic elements, embedded memory, and a surface-mount exposed pad package supports designs that require integration without moving to larger or different device families.
If you would like pricing, availability, or to request a quote for EP4CE22E22C8L, submit a quote request or contact sales through your regular procurement channel.

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