EP4CE22E22C8LN

IC FPGA 79 I/O 144EQFP
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 79 608256 22320 144-LQFP Exposed Pad

Quantity 524 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFP Exposed PadNumber of I/O79Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1395Number of Logic Elements/Cells22320
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits608256

Overview of EP4CE22E22C8LN – Cyclone® IV E FPGA, 144-LQFP Exposed Pad

The EP4CE22E22C8LN is a Field Programmable Gate Array (FPGA) IC from Intel, based on the Cyclone® IV E family architecture. It provides integrated programmable logic, embedded memory, and a defined set of I/O resources in a compact surface-mount package.

This device is intended for designs that require a specific balance of logic capacity, on‑chip memory, and I/O count while operating within commercial temperature and core-voltage ranges.

Key Features

  • Logic Capacity  Provides 22,320 logic elements to implement a wide range of mid-complexity programmable logic functions.
  • Embedded Memory  Approximately 0.61 Mbits of total on-chip RAM (608,256 bits) for FIFOs, buffering, and small data storage.
  • I/O Resources  Offers 79 general-purpose I/O pins to interface with peripherals and system signals.
  • Core Power  Specified core voltage range of 0.970 V to 1.030 V to match low-voltage system rails and core requirements.
  • Package & Mounting  Available in a 144-LQFP exposed pad package (supplier device package: 144-EQFP, 20×20 mm) optimized for surface-mount assembly.
  • Operating Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C ambient operation.
  • RoHS Compliance  Manufactured in compliance with RoHS requirements.

Unique Advantages

  • Significant on-chip logic: 22,320 logic elements let you consolidate functions that otherwise require additional discrete logic, reducing board-level complexity.
  • Embedded memory for data handling: Approximately 0.61 Mbits of on-chip RAM supports buffering and small-scale data storage without external memory.
  • Ample I/O flexibility: 79 I/O pins provide direct connectivity for peripheral interfaces and control signals, simplifying system integration.
  • Compact, manufacturable package: 144-LQFP with exposed pad and 20×20 mm EQFP footprint enables reliable surface-mount assembly and thermal conduction options.
  • Low-voltage core compatibility: Core supply specified between 0.97 V and 1.03 V enables integration with modern low-voltage power rails.
  • Compliance and commercial readiness: RoHS compliance and commercial temperature rating make the device suitable for consumer and industrial-adjacent electronics designed for standard environments.

Why Choose EP4CE22E22C8LN?

The EP4CE22E22C8LN is positioned for designs that require a balanced combination of programmable logic, embedded RAM, and multi-pin I/O in a compact surface-mount package. With 22,320 logic elements and approximately 0.61 Mbits of on-chip RAM, the device supports a range of mid-complexity FPGA implementations while maintaining a defined core-voltage and commercial operating-temperature profile.

Manufactured by Intel and delivered in a 144-LQFP exposed-pad package, this Cyclone IV E FPGA variant offers predictable electrical and mechanical characteristics for teams focused on reliable, repeatable production and integration into standard SMT processes.

Request a quote or submit a procurement inquiry to receive pricing and availability information for EP4CE22E22C8LN.

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