EP4CE22E22C8LN
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 79 608256 22320 144-LQFP Exposed Pad |
|---|---|
| Quantity | 524 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 79 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1395 | Number of Logic Elements/Cells | 22320 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 608256 |
Overview of EP4CE22E22C8LN – Cyclone® IV E FPGA, 144-LQFP Exposed Pad
The EP4CE22E22C8LN is a Field Programmable Gate Array (FPGA) IC from Intel, based on the Cyclone® IV E family architecture. It provides integrated programmable logic, embedded memory, and a defined set of I/O resources in a compact surface-mount package.
This device is intended for designs that require a specific balance of logic capacity, on‑chip memory, and I/O count while operating within commercial temperature and core-voltage ranges.
Key Features
- Logic Capacity Provides 22,320 logic elements to implement a wide range of mid-complexity programmable logic functions.
- Embedded Memory Approximately 0.61 Mbits of total on-chip RAM (608,256 bits) for FIFOs, buffering, and small data storage.
- I/O Resources Offers 79 general-purpose I/O pins to interface with peripherals and system signals.
- Core Power Specified core voltage range of 0.970 V to 1.030 V to match low-voltage system rails and core requirements.
- Package & Mounting Available in a 144-LQFP exposed pad package (supplier device package: 144-EQFP, 20×20 mm) optimized for surface-mount assembly.
- Operating Temperature & Grade Commercial-grade device rated for 0 °C to 85 °C ambient operation.
- RoHS Compliance Manufactured in compliance with RoHS requirements.
Unique Advantages
- Significant on-chip logic: 22,320 logic elements let you consolidate functions that otherwise require additional discrete logic, reducing board-level complexity.
- Embedded memory for data handling: Approximately 0.61 Mbits of on-chip RAM supports buffering and small-scale data storage without external memory.
- Ample I/O flexibility: 79 I/O pins provide direct connectivity for peripheral interfaces and control signals, simplifying system integration.
- Compact, manufacturable package: 144-LQFP with exposed pad and 20×20 mm EQFP footprint enables reliable surface-mount assembly and thermal conduction options.
- Low-voltage core compatibility: Core supply specified between 0.97 V and 1.03 V enables integration with modern low-voltage power rails.
- Compliance and commercial readiness: RoHS compliance and commercial temperature rating make the device suitable for consumer and industrial-adjacent electronics designed for standard environments.
Why Choose EP4CE22E22C8LN?
The EP4CE22E22C8LN is positioned for designs that require a balanced combination of programmable logic, embedded RAM, and multi-pin I/O in a compact surface-mount package. With 22,320 logic elements and approximately 0.61 Mbits of on-chip RAM, the device supports a range of mid-complexity FPGA implementations while maintaining a defined core-voltage and commercial operating-temperature profile.
Manufactured by Intel and delivered in a 144-LQFP exposed-pad package, this Cyclone IV E FPGA variant offers predictable electrical and mechanical characteristics for teams focused on reliable, repeatable production and integration into standard SMT processes.
Request a quote or submit a procurement inquiry to receive pricing and availability information for EP4CE22E22C8LN.

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