EP4CE22E22C7N
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 79 608256 22320 144-LQFP Exposed Pad |
|---|---|
| Quantity | 1,685 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 79 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1395 | Number of Logic Elements/Cells | 22320 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 608256 |
Overview of EP4CE22E22C7N – Cyclone® IV E FPGA, 22,320 logic elements, 144-LQFP
The EP4CE22E22C7N is a Cyclone® IV E field programmable gate array (FPGA) offered by Intel. It provides a mid-range programmable logic fabric with 22,320 logic elements and embedded RAM to implement custom digital logic and memory functions.
Designed as a surface-mount device in a 144-LQFP exposed pad package, the device supports up to 79 general-purpose I/O pins, a core supply range of 1.15 V to 1.25 V, and commercial-grade operating temperatures from 0 °C to 85 °C. Detailed device specifications are documented in the Cyclone IV Device Handbook, Volume 3.
Key Features
- Logic Capacity — 22,320 logic elements to implement complex combinational and sequential logic functions.
- Embedded Memory — 608,256 bits of on-chip RAM (approximately 0.61 Mbits) for local data storage and buffering.
- I/O Count — Up to 79 general-purpose I/O pins for interfacing with peripherals, sensors, and external logic.
- Power and Core Voltage — Core voltage operating range of 1.15 V to 1.25 V to match system power domains.
- Package and Mounting — 144-LQFP exposed pad package (supplier device package: 144-EQFP, 20 × 20) in a surface-mount form factor for PCB integration.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for commercial electronics applications.
- Regulatory Compliance — RoHS-compliant.
- Documentation — Device-level details such as operating conditions, DC characteristics, switching characteristics, and power consumption are available in the Cyclone IV Device Handbook, Volume 3.
Typical Applications
- Mid-range programmable logic designs — Implement custom digital functions that require on-chip logic and RAM capacity without external programmable logic chips.
- Embedded memory-centric functions — Use the device's approximately 0.61 Mbits of embedded RAM for buffering, FIFOs, and small on-chip data stores.
- Interface and peripheral bridging — Employ up to 79 I/O pins to connect and translate between multiple system peripherals or external devices.
Unique Advantages
- Substantial logic density: 22,320 logic elements allow implementation of substantial custom logic while keeping the bill of materials compact.
- On-chip memory for efficient designs: Approximately 0.61 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
- Flexible I/O capacity: 79 I/O pins provide the connectivity needed for multi-signal interfaces and peripheral control.
- Compact surface-mount package: 144-LQFP exposed pad (20 × 20 supplier package) supports compact PCB layouts and thermal pad mounting.
- Clear device documentation: The Cyclone IV Device Handbook, Volume 3 contains detailed electrical specifications and operating condition guidance to support design and validation.
- RoHS compliance: Conforms to RoHS requirements for environmentally constrained designs.
Why Choose EP4CE22E22C7N?
The EP4CE22E22C7N positions as a commercial-grade Cyclone IV E FPGA option for designs that require a balance of logic capacity, embedded memory, and I/O in a compact surface-mount package. Its specification set—22,320 logic elements, approximately 0.61 Mbits of on-chip RAM, 79 I/O pins, and a 1.15 V to 1.25 V core supply range—helps streamline designs that need integrated programmable logic with local memory.
This device is suited to developers and procurement teams looking for a documented, RoHS-compliant FPGA solution with defined operating conditions and characteristics described in the Cyclone IV Device Handbook, Volume 3. Its combination of logic density, memory, and package options supports scalable designs and predictable integration into commercial electronic products.
Request a quote or submit a parts inquiry to receive pricing, availability, and lead-time information for the EP4CE22E22C7N.

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