EP4CE22E22C8N

IC FPGA 79 I/O 144EQFP
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 79 608256 22320 144-LQFP Exposed Pad

Quantity 1,090 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFP Exposed PadNumber of I/O79Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1395Number of Logic Elements/Cells22320
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits608256

Overview of EP4CE22E22C8N – Cyclone® IV E Field Programmable Gate Array (FPGA) IC, 144-LQFP Exposed Pad

The EP4CE22E22C8N is a Cyclone IV E field programmable gate array (FPGA) from Intel, provided in a 144-LQFP exposed pad package. It delivers a mid-range logic capacity and on-chip memory suitable for commercial embedded designs and prototype development.

Key device characteristics include 22,320 logic elements, approximately 0.608 Mbits of embedded memory, 79 user I/O pins, and a low-voltage core supply range of 1.15 V to 1.25 V. The device is rated for commercial operating temperatures from 0 °C to 85 °C and is RoHS compliant.

Key Features

  • Core Logic  22,320 logic elements organized across 1,395 logic blocks provide configurable digital logic capacity for custom designs.
  • Embedded Memory  Approximately 0.608 Mbits of on-chip RAM to support packet buffering, small data stores, and state machines without external memory.
  • I/O  79 user I/O pins for flexible interfacing to peripherals, sensors, and external devices in compact systems.
  • Power  Core supply voltage specified from 1.15 V to 1.25 V to match low-voltage system architectures.
  • Package & Mounting  144-LQFP exposed pad package (supplier package: 144‑EQFP, 20 × 20) designed for surface-mount assembly with exposed pad for thermal handling.
  • Operating Range & Grade  Commercial grade device specified for 0 °C to 85 °C operation.
  • Compliance  RoHS compliant for regulatory and environmental adherence.
  • Documentation  Supported by the Cyclone IV Device Handbook and device datasheet for electrical, timing, and application guidance.

Typical Applications

  • Commercial Embedded Systems  Use the FPGA for implementing custom control logic, I/O aggregation, and glue logic in compact, low-voltage products.
  • Prototyping and Evaluation  Leverage the device’s mid-range logic and on-chip memory for validating algorithms and system architectures during development cycles.
  • Interface Bridging  Deploy the 79 I/Os to consolidate multiple peripheral interfaces or implement protocol translation in space-constrained designs.
  • Custom Control and Sequencing  Implement state machines, timing control, and deterministic logic functions using the available logic elements and embedded RAM.

Unique Advantages

  • Balanced Logic and Memory:  22,320 logic elements combined with approximately 0.608 Mbits of RAM enable a wide range of mid-complexity logic functions without mandatory external memory.
  • Compact, Surface-Mount Package:  144-LQFP exposed pad (20 × 20 supplier package) supports dense PCB layouts and improved thermal dissipation through the exposed pad.
  • Low-Voltage Core Support:  1.15 V to 1.25 V core supply supports integration into modern low-voltage systems while managing power budget.
  • Flexible I/O Count:  79 available I/Os provide the connectivity needed for multi-peripheral and mixed-signal interfacing in a single device.
  • Commercial Temperature Rating:  Specified 0 °C to 85 °C operating range for consumer and commercial applications.
  • Regulatory Compliance:  RoHS compliance simplifies environmental risk assessment for product manufacturing and distribution.

Why Choose EP4CE22E22C8N?

The EP4CE22E22C8N positions itself as a practical, mid-range Cyclone IV E FPGA for commercial embedded designs that require a balance of logic capacity, embedded memory, and flexible I/O in a compact surface-mount package. Its documented specifications and device handbook provide engineers with the electrical and timing information needed for integration and validation.

This device is well suited for teams and projects that need configurable hardware resources within a defined commercial temperature envelope and low-voltage core architecture, backed by manufacturer documentation for design planning and implementation.

If you would like pricing, availability, or a quotation for EP4CE22E22C8N, please request a quote or submit an inquiry to obtain further purchasing information.

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