EP4CE22E22I7N

The EP4CE22E22I7N is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC offering a mid-range complement of programmable logic and on-chip memory in a 144-LQFP exposed pad package. Designed for applications that require configurable logic, multiple I/O and industrial temperature capability, this device provides a balance of integration, I/O density and power supply flexibility.

Built to Cyclone IV E family conventions, the device targets system designs where deterministic I/O, embedded memory and platform-level integration are important—particularly in industrial and embedded environments that require operation from −40 °C to 100 °C.

Key Features

• Programmable Logic  Approximately 22,320 logic elements for implementing custom digital functions, state machines and glue logic.
• Embedded Memory  Approximately 0.61 Mbits of on-chip RAM to support FIFOs, buffering and small data storage needs within the FPGA fabric.
• I/O Capacity  79 user I/O pins to interface with peripherals, sensors and external logic networks.
• Power Supply  Core voltage support from 1.15 V to 1.25 V, allowing designers to match system power rails and manage core power requirements.
• Package & Mounting  Surface-mount 144-LQFP exposed pad (supplier package: 144-EQFP, 20×20) for compact PCB integration and board-level assembly.
• Grade & Temperature Range  Industrial grade with an operating temperature range of −40 °C to 100 °C suitable for many industrial and rugged embedded applications.
• Standards Compliance  RoHS compliant, meeting common material and environmental requirements for modern electronics manufacturing.

Typical Applications

• Industrial control and automation  Use the EP4CE22E22I7N for control logic, I/O consolidation and protocol bridging in systems that require industrial temperature operation.
• Embedded systems and instrumentation  Implement custom state machines, interface logic and small buffering functions where compact package size and on-chip memory improve system integration.
• Communications and protocol conversion  Deploy as a mid-density logic device for glue logic, data formatting and peripheral interface tasks that need multiple user I/Os.

Unique Advantages

• Mid-density programmable logic: Provides 22,320 logic elements to implement a wide range of custom digital functions without overprovisioning.
• Embedded RAM for local buffering: Approximately 0.61 Mbits of on-chip memory reduces reliance on external memory for small data storage and FIFO requirements.
• Industrial-ready thermal range: Rated for −40 °C to 100 °C operation, enabling deployment in harsher environmental conditions common to industrial equipment.
• Compact surface-mount package: The 144-LQFP exposed pad package (20×20 supplier footprint) supports compact PCB layouts and standard SMT assembly.
• RoHS compliant: Meets material restrictions for modern manufacturing processes and regulatory environments.

Why Choose EP4CE22E22I7N?

The EP4CE22E22I7N offers a balanced combination of logic density, embedded memory and I/O in a compact 144-LQFP exposed pad package, with an industrial temperature rating for dependable operation in demanding environments. Its core voltage range and RoHS compliance make it suitable for integration into contemporary embedded systems and industrial control platforms.

This device is well suited to engineering teams seeking a Cyclone IV E FPGA with mid-range resources for protocol bridging, control logic and I/O-centric designs that demand reliable operation across a wide temperature range and a compact board footprint.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the EP4CE22E22I7N. Our team can provide lead-time details and support for your procurement process.