EP4CE22E22I8LN
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 79 608256 22320 144-LQFP Exposed Pad |
|---|---|
| Quantity | 783 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 79 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1395 | Number of Logic Elements/Cells | 22320 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 608256 |
Overview of EP4CE22E22I8LN – Cyclone® IV E FPGA, 22,320 logic elements, 144-LQFP Exposed Pad
The EP4CE22E22I8LN is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC designed to provide programmable logic resources for industrial embedded applications. It combines 22,320 logic elements with approximately 0.61 Mbits of on-chip RAM and up to 79 I/O pins in a 144-LQFP exposed pad package to support custom digital logic, control and interfacing tasks.
Engineered for surface-mount assembly and industrial operation, this device is specified for a core voltage range of 0.970 V to 1.03 V and an operating temperature range of −40 °C to 100 °C, making it suitable for designs that require stable performance across a wide temperature span.
Key Features
- Programmable Logic Capacity 22,320 logic elements provide ample resources for mid-density FPGA designs and custom hardware implementations.
- Embedded Memory Approximately 0.61 Mbits of on-chip RAM for buffering, state storage, and small data structures.
- Flexible I/O Up to 79 general-purpose I/O pins to support interfacing with peripherals, sensors, and external devices.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
- Low-Voltage Core Supply Core supply specified between 0.970 V and 1.03 V for the device core domain.
- Package and Mounting 144-LQFP with exposed pad (supplier device package listed as 144-EQFP 20×20) optimized for surface-mount PCB assembly and thermal conduction.
- Regulatory Status RoHS compliant.
- Comprehensive Documentation Datasheet and device handbook content cover operating conditions, absolute maximum ratings, DC characteristics, switching characteristics, and power consumption data.
Typical Applications
- Industrial control and automation Implement custom logic, sequence control, and I/O aggregation within an industrial temperature-rated FPGA platform.
- Embedded systems and prototyping Deliver custom hardware functions and rapid prototyping using 22,320 logic elements and on-chip RAM.
- Interface bridging and peripheral aggregation Use the available 79 I/O pins to connect and translate between multiple external devices and buses.
- Hardware offload and acceleration Offload specific computational or control tasks to programmable logic to optimize system partitioning.
Unique Advantages
- Balanced logic and memory The combination of 22,320 logic elements and ~0.61 Mbits of RAM supports a wide range of mid-density designs without external memory for small buffers.
- Industrial robustness Specified for −40 °C to 100 °C operation, enabling deployment in temperature-challenging environments.
- Compact, assembly-ready package 144-LQFP exposed pad with surface-mount mounting simplifies PCB integration and improves thermal performance.
- Low-voltage core operation Narrow core voltage range (0.970 V–1.03 V) assists in predictable power-domain planning for system design.
- Regulatory compliance RoHS compliant for use in environments requiring restricted-substance adherence.
- Documented device characteristics Available datasheet content documents operating conditions, DC and switching characteristics, power consumption, and other design-critical parameters.
Why Choose EP4CE22E22I8LN?
The EP4CE22E22I8LN positions itself as a practical mid-density Cyclone IV E FPGA option for industrial and embedded designs that require a substantial number of logic elements, moderate on-chip memory, and a flexible I/O count in a compact surface-mount package. Its industrial temperature rating and documented electrical characteristics support robust deployment across a range of operational environments.
This device is suitable for engineers and designers seeking a programmable logic solution that balances integration, thermal considerations via an exposed pad package, and clear specification data for system-level planning and verification.
If you would like pricing, availability, or a formal quote for EP4CE22E22I8LN, submit a request for pricing and availability or request a quote through your procurement process.

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