EP4CE22E22I8LN

IC FPGA 79 I/O 144EQFP
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 79 608256 22320 144-LQFP Exposed Pad

Quantity 783 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFP Exposed PadNumber of I/O79Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1395Number of Logic Elements/Cells22320
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits608256

Overview of EP4CE22E22I8LN – Cyclone® IV E FPGA, 22,320 logic elements, 144-LQFP Exposed Pad

The EP4CE22E22I8LN is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC designed to provide programmable logic resources for industrial embedded applications. It combines 22,320 logic elements with approximately 0.61 Mbits of on-chip RAM and up to 79 I/O pins in a 144-LQFP exposed pad package to support custom digital logic, control and interfacing tasks.

Engineered for surface-mount assembly and industrial operation, this device is specified for a core voltage range of 0.970 V to 1.03 V and an operating temperature range of −40 °C to 100 °C, making it suitable for designs that require stable performance across a wide temperature span.

Key Features

  • Programmable Logic Capacity  22,320 logic elements provide ample resources for mid-density FPGA designs and custom hardware implementations.
  • Embedded Memory  Approximately 0.61 Mbits of on-chip RAM for buffering, state storage, and small data structures.
  • Flexible I/O  Up to 79 general-purpose I/O pins to support interfacing with peripherals, sensors, and external devices.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
  • Low-Voltage Core Supply  Core supply specified between 0.970 V and 1.03 V for the device core domain.
  • Package and Mounting  144-LQFP with exposed pad (supplier device package listed as 144-EQFP 20×20) optimized for surface-mount PCB assembly and thermal conduction.
  • Regulatory Status  RoHS compliant.
  • Comprehensive Documentation  Datasheet and device handbook content cover operating conditions, absolute maximum ratings, DC characteristics, switching characteristics, and power consumption data.

Typical Applications

  • Industrial control and automation  Implement custom logic, sequence control, and I/O aggregation within an industrial temperature-rated FPGA platform.
  • Embedded systems and prototyping  Deliver custom hardware functions and rapid prototyping using 22,320 logic elements and on-chip RAM.
  • Interface bridging and peripheral aggregation  Use the available 79 I/O pins to connect and translate between multiple external devices and buses.
  • Hardware offload and acceleration  Offload specific computational or control tasks to programmable logic to optimize system partitioning.

Unique Advantages

  • Balanced logic and memory  The combination of 22,320 logic elements and ~0.61 Mbits of RAM supports a wide range of mid-density designs without external memory for small buffers.
  • Industrial robustness  Specified for −40 °C to 100 °C operation, enabling deployment in temperature-challenging environments.
  • Compact, assembly-ready package  144-LQFP exposed pad with surface-mount mounting simplifies PCB integration and improves thermal performance.
  • Low-voltage core operation  Narrow core voltage range (0.970 V–1.03 V) assists in predictable power-domain planning for system design.
  • Regulatory compliance  RoHS compliant for use in environments requiring restricted-substance adherence.
  • Documented device characteristics  Available datasheet content documents operating conditions, DC and switching characteristics, power consumption, and other design-critical parameters.

Why Choose EP4CE22E22I8LN?

The EP4CE22E22I8LN positions itself as a practical mid-density Cyclone IV E FPGA option for industrial and embedded designs that require a substantial number of logic elements, moderate on-chip memory, and a flexible I/O count in a compact surface-mount package. Its industrial temperature rating and documented electrical characteristics support robust deployment across a range of operational environments.

This device is suitable for engineers and designers seeking a programmable logic solution that balances integration, thermal considerations via an exposed pad package, and clear specification data for system-level planning and verification.

If you would like pricing, availability, or a formal quote for EP4CE22E22I8LN, submit a request for pricing and availability or request a quote through your procurement process.

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