EP4CE22F17C6
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 153 608256 22320 256-LBGA |
|---|---|
| Quantity | 185 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 153 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1395 | Number of Logic Elements/Cells | 22320 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 608256 |
Overview of EP4CE22F17C6 – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 153 I/Os, ~0.608 Mbits RAM, 22,320 Logic Elements, 256-LBGA
The EP4CE22F17C6 is a Cyclone IV E family FPGA manufactured by Intel, delivered in a 256-LBGA package and targeted for commercial-grade programmable logic applications. It integrates 22,320 logic elements and approximately 0.608 Mbits of embedded memory, providing a compact platform for customizable digital logic and system integration.
With 153 available I/Os, a 1.15 V to 1.25 V core supply range, surface-mount package, and an operating temperature range of 0 °C to 85 °C, this device is suited to commercial embedded designs that require moderate logic density, flexible I/O connectivity, and RoHS-compliant manufacturing.
Key Features
- Core Capacity — 22,320 logic elements provide substantial programmable logic resources for mid-density designs and custom digital functions.
- Memory — Total on-chip memory of 608,256 bits, expressed as approximately 0.608 Mbits of embedded RAM for FIFOs, buffers, and small lookup tables.
- I/O — 153 general-purpose I/O pins support flexible interfacing and peripheral connectivity for a wide range of signals.
- Logic Array Blocks — The device includes 1,395 logic array blocks to partition and organize logic resources within designs.
- Power — Core voltage supply range of 1.15 V to 1.25 V enables defined power budgeting and voltage-domain planning.
- Package & Mounting — Supplied in a 256-LBGA (supplier package: 256-FBGA, 17 × 17) surface-mount package for compact PCB footprints and high pin density.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operation, suitable for commercial-environment deployments.
- Compliance — RoHS-compliant to support environmentally conscious manufacturing and product selection.
Typical Applications
- Commercial Embedded Systems — Use the device’s 22,320 logic elements and 153 I/Os to implement custom control, glue logic, and peripheral interfaces in commercial products.
- Prototyping and Development — Mid-density programmable resources and compact 256-LBGA packaging make it practical for evaluation boards and proof-of-concept designs.
- Interface Bridging — Deploy the available I/O and on-chip memory to create protocol translators, bus interfaces, or I/O expanders within a commercial product environment.
- Digital Signal Glue Logic — Implement data-path control, simple DSP blocks, and timing logic using the embedded RAM and logic element resources.
Unique Advantages
- Balanced Logic and Memory — 22,320 logic elements paired with ~0.608 Mbits of RAM provide a balanced resource mix for control and data buffering without excessive board-level components.
- High I/O Count in Compact Package — 153 I/Os in a 256-LBGA (17 × 17) footprint enables dense connectivity while preserving PCB real estate.
- Commercial-Grade Reliability — Rated for 0 °C to 85 °C operation and RoHS-compliant manufacturing for commercial product lifecycles.
- Predictable Power Domain — Defined core supply range (1.15 V to 1.25 V) simplifies power-supply design and thermal planning for commercial systems.
- Documented Family Support — Part of the Cyclone IV device family with accompanying device handbook and datasheet resources for engineering reference and design verification.
Why Choose EP4CE22F17C6?
The EP4CE22F17C6 positions itself as a practical choice for commercial designs that need mid-range programmable logic capacity, a modest amount of embedded memory, and ample I/O in a compact surface-mount package. Its specification set supports flexible implementation of control logic, interface bridging, and prototype platforms where RoHS compliance and commercial temperature ratings are required.
This device is well suited to engineers and product teams looking for a supported Cyclone IV E family FPGA with clear electrical and thermal parameters, documented device guidance, and a form factor that integrates cleanly into space-constrained PCBs.
Request a quote or submit a pricing inquiry for EP4CE22F17C6 to evaluate availability and procurement options for your next commercial FPGA-based design.

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