EP4CE22F17A7N
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 153 608256 22320 256-LBGA |
|---|---|
| Quantity | 1,281 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 153 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1395 | Number of Logic Elements/Cells | 22320 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 608256 |
Overview of EP4CE22F17A7N – Cyclone® IV E FPGA, 22,320 logic elements, 256‑LBGA
The EP4CE22F17A7N is a Cyclone® IV E field programmable gate array (FPGA) in a 256‑LBGA package. It integrates 22,320 logic elements, a substantial block of on‑chip RAM, and 153 user I/Os to support flexible digital logic and system integration.
Designed for applications that require a combination of logic capacity, embedded memory and robust environmental performance, this device offers a compact package and automotive‑grade qualification for use in demanding operating conditions.
Key Features
- Logic Capacity 22,320 logic elements provide programmable resources for custom digital functions and hardware acceleration.
- Embedded Memory Approximately 0.61 Mbits of on‑chip RAM for data buffering, FIFOs and small lookup tables.
- I/O and Package 153 user I/Os in a 256‑LBGA package (supplier device package listed as 256‑FBGA, 17×17) for dense PCB routing and board‑level integration.
- Power Core voltage supply range of 1.15 V to 1.25 V to match platform power constraints and support predictable power budgeting.
- Automotive Qualification Grade: Automotive with AEC‑Q100 qualification for use in applications requiring that industry qualification.
- Temperature Range & Mounting Rated for operation from −40 °C to 125 °C and supplied in a surface‑mount package for reliable deployment in harsh environments.
Typical Applications
- Automotive Systems Suitable for automotive electronic subsystems where AEC‑Q100 qualification and a −40 °C to 125 °C operating range are required.
- Sensor and I/O Bridging The 153 I/Os enable protocol bridging and multi‑sensor interfaces for systems that consolidate signals and pre‑process data in hardware.
- Embedded Control and Logic Customization 22,320 logic elements and on‑chip RAM support custom control logic, state machines and embedded acceleration functions.
Unique Advantages
- Automotive‑grade Qualification: AEC‑Q100 qualification and automotive grade designation align the device to automotive program requirements.
- Substantial Logic Resources: 22,320 logic elements enable complex FPGA designs without immediate need for a larger device.
- On‑chip Memory: Approximately 0.61 Mbits of embedded RAM reduces reliance on external memory for buffering and small data tables.
- High I/O Count in Compact Package: 153 I/Os in a 256‑LBGA/256‑FBGA (17×17) footprint allow dense signal routing in space‑constrained designs.
- Wide Operating Temperature: Rated from −40 °C to 125 °C to support deployment in temperature‑challenging environments.
- Low‑voltage Core: 1.15–1.25 V supply range supports modern low‑voltage power architectures.
Why Choose EP4CE22F17A7N?
The EP4CE22F17A7N combines sizable programmable logic, embedded memory and a high I/O count within a compact 256‑LBGA package, making it a practical choice for engineers who need to implement custom digital logic and I/O consolidation in constrained layouts. Its automotive grade and AEC‑Q100 qualification, together with a −40 °C to 125 °C operating range, provide confidence for designs that require enhanced environmental robustness.
This FPGA is well suited to teams developing automotive subsystems, sensor interface modules, and embedded control solutions that demand predictable power characteristics, measurable logic resources and board‑level integration in a surface‑mount package.
Request a quote or submit an inquiry to learn more about availability and pricing for the EP4CE22F17A7N.

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