EP4CE22F17C7

The EP4CE22F17C7 is an Intel Cyclone IV family field programmable gate array (FPGA) offered in a 256-LBGA package. It provides 22,320 logic elements, approximately 0.608 Mbits of embedded memory, and 153 general-purpose I/O pins for configurable digital-system designs.

Designed as a commercial-grade, surface-mount FPGA, the device operates from a core supply of 1.15 V to 1.25 V and supports an ambient operating temperature range of 0 °C to 85 °C. The part is RoHS-compliant.

Key Features

• Core Logic  22,320 logic elements (cells) provide substantial configurable logic capacity for custom digital functions and control logic.
• Embedded Memory  Approximately 0.608 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory in many designs.
• I/O Density  153 I/O pins allow flexible interfacing to external devices, sensors, and peripherals.
• Power  Core supply voltage range of 1.15 V to 1.25 V to match target system power architectures.
• Package & Mounting  Available in a 256-LBGA (256-FBGA, 17×17) package suitable for surface-mount PCB assembly and compact board layouts.
• Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C ambient operation.
• Environmental Compliance  RoHS-compliant construction for regulatory alignment in many product designs.

Typical Applications

• Embedded Systems  Implement custom control logic, protocol bridges, and integration glue where reprogrammability and I/O count are required.
• Prototyping & Development  Use the device for hardware prototyping and iterative digital design due to its programmable logic capacity and on-chip memory.
• Communications & Interfaces  Implement custom interface logic and protocol conversion leveraging the available I/O and embedded RAM.

Unique Advantages

• Substantial Logic Capacity: 22,320 logic elements enable complex logic implementations without immediately moving to larger device families.
• On-Chip Memory: Approximately 0.608 Mbits of embedded RAM reduce dependence on external memory for many control and buffering tasks.
• Generous I/O Count: 153 I/O pins support multiple external interfaces and parallel connections, simplifying board-level routing for I/O-heavy designs.
• Compact, Surface-Mount Package: The 256-LBGA (256-FBGA, 17×17) package balances board space and thermal considerations for dense PCBs.
• Low-Voltage Core: A 1.15 V–1.25 V core supply range aligns with modern power rails and helps integration with low-voltage systems.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose EP4CE22F17C7?

The EP4CE22F17C7 delivers a balanced combination of configurable logic, embedded memory, and I/O density in a compact 256-LBGA package. Its commercial temperature rating and surface-mount form factor make it well suited for production embedded designs and development prototypes where reprogrammability and integration flexibility are priorities.

Engineers and teams seeking a mid-density Cyclone IV FPGA can leverage the device’s logic and memory resources to accelerate custom digital designs while maintaining compact board footprints and compliance with RoHS requirements.

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