EP4CE22E22I7

IC FPGA 79 I/O 144EQFP
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 79 608256 22320 144-LQFP Exposed Pad

Quantity 1,617 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFP Exposed PadNumber of I/O79Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1395Number of Logic Elements/Cells22320
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits608256

Overview of EP4CE22E22I7 – Cyclone IV E FPGA, 22,320 logic elements, 79 I/Os, 144-LQFP

The EP4CE22E22I7 is an Intel Cyclone IV E field programmable gate array (FPGA) offered in a 144-pin exposed-pad LQFP package. It provides 22,320 logic elements and approximately 0.61 Mbits of embedded RAM, along with 79 general-purpose I/Os, making it suitable for industrial-grade embedded logic and I/O consolidation.

This device targets designs requiring programmable logic capacity in a surface-mount, exposed-pad package and supports operation across a wide industrial temperature range with a core supply window of 1.15 V to 1.25 V.

Key Features

  • FPGA Core Cyclone IV E architecture providing 22,320 logic elements for mid-range programmable logic implementations.
  • Embedded Memory Approximately 0.61 Mbits of on-chip RAM to support buffering, state storage, and small data-path requirements without external memory.
  • I/O Capacity 79 available I/Os for flexible interfacing to peripherals, sensors, and external devices in a compact package.
  • Power Core supply voltage range from 1.15 V to 1.25 V to match system power-rail planning and FPGA supply needs.
  • Package and Mounting 144-pin LQFP exposed pad package (supplier device package listed as 144-EQFP, 20×20) in a surface-mount footprint for PCB integration and thermal dissipation via the exposed pad.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet environmental requirements in industrial applications.
  • Standards and Compliance RoHS compliant, supporting regulatory and manufacturing requirements for lead-free assemblies.
  • Technical Reference Supported by Cyclone IV device handbook material covering operating conditions, DC characteristics, switching characteristics, and device-level specifications.

Typical Applications

  • Industrial Control and Automation Programmable logic capacity and industrial temperature rating allow implementation of control algorithms, I/O aggregation, and interface logic in factory and process equipment.
  • Embedded Interface and Protocol Bridging Use the available I/Os and on-chip RAM to implement custom protocol conversion, signal conditioning logic, and peripheral bridging without large external components.
  • Custom Logic for Industrial Equipment Implement timing-critical or deterministic logic functions directly in the FPGA fabric for specialized machinery and instrumentation.

Unique Advantages

  • Substantial Logic Capacity: 22,320 logic elements provide significant room for mid-range FPGA designs and complex glue-logic implementations.
  • On-chip Memory for Efficient Designs: Approximately 0.61 Mbits of embedded RAM reduces dependence on external memory for buffering and small data storage tasks.
  • Industrial-Grade Operation: Rated from −40 °C to 100 °C, enabling deployment in a broad range of industrial environments.
  • Compact Surface-Mount Package with Thermal Pad: 144-LQFP exposed pad package supports PCB-level thermal management and space-constrained board layouts.
  • Narrow Core Voltage Window: Defined 1.15 V to 1.25 V supply range simplifies power-supply design and integration with regulated core rails.
  • Regulatory Compliance: RoHS compliance supports lead-free manufacturing requirements.

Why Choose EP4CE22E22I7?

The EP4CE22E22I7 delivers a balanced combination of programmable logic capacity, embedded memory, and I/O resources in a thermally-conscious exposed-pad LQFP package. Its industrial temperature rating and RoHS compliance make it a pragmatic choice for embedded designs that require reliable operation across a broad temperature range.

This device is suited for engineers and teams implementing mid-range FPGA designs where on-chip RAM, flexible I/O, and a compact surface-mount package are key requirements. The Cyclone IV device handbook material provides detailed electrical and performance specifications to support design and validation activities.

Request a quote or submit an inquiry for pricing and availability of the EP4CE22E22I7 to evaluate it for your next industrial embedded project.

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