EP4CE22E22C8

The EP4CE22E22C8 is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 144-LQFP exposed pad package for surface-mount assembly. This commercial-grade FPGA integrates a substantial logic fabric and on-chip memory to support a wide range of commercial embedded designs.

With 22,320 logic elements, approximately 0.61 Mbits of embedded RAM and 79 general I/O pins, the device provides a balanced combination of logic capacity, on-chip storage, and I/O density while operating at a core voltage range of 1.15 V to 1.25 V and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic Capacity  22,320 logic elements for implementing medium-complexity digital functions and custom logic blocks.
• Embedded Memory  Approximately 0.61 Mbits of on-chip RAM (608,256 total RAM bits) to support buffering, FIFOs and on-chip data storage.
• I/O Resources  79 I/O pins to connect to peripherals, sensors, and external interfaces.
• Package & Mounting  144-LQFP exposed pad (supplier device package: 144-EQFP, 20 × 20 mm) and surface-mount mounting for compact board designs and thermal conduction through the exposed pad.
• Power  Core voltage supply specified from 1.15 V to 1.25 V for the FPGA core.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Regulatory  RoHS compliant.
• Documentation  Device is part of the Cyclone IV family; detailed device and operating specifications appear in the Cyclone IV Device Handbook.

Unique Advantages

• High logic density: 22,320 logic elements provide a substantial resource pool for implementing complex digital functions without immediate need for larger devices.
• On-chip memory for system-level buffering: Approximately 0.61 Mbits of embedded RAM reduces reliance on external memory for many control and buffering tasks.
• Generous I/O count: 79 I/Os support multiple peripheral interfaces and parallel connections for sensors, displays, and control signals.
• Compact, manufacturable package: 144-LQFP with an exposed pad supports surface-mount PCB assembly and improved thermal path for reliable operation in commercial systems.
• Optimized core voltage: Narrow core supply range (1.15 V–1.25 V) simplifies power-supply design for the FPGA core.
• Commercial grading and RoHS compliance: Suitable for standard commercial electronics and compliant with RoHS requirements for lead-free assembly.

Why Choose EP4CE22E22C8?

The EP4CE22E22C8 positions itself as a capable mid-range Cyclone IV E FPGA that balances logic capacity, embedded memory and I/O density in a manufacturable 144-LQFP exposed pad package. It is well suited to commercial embedded designs that require integrated programmable logic and on-chip storage while operating within a 0 °C to 85 °C temperature window and a defined core supply range.

For design teams seeking a tested device family and device-level documentation, the Cyclone IV Device Handbook provides the detailed electrical, thermal and switching specifications needed for system integration and verification.

Request a quote or submit a pricing inquiry to check availability and lead times for the EP4CE22E22C8.