EP4CE22E22A7N

IC FPGA 79 I/O 144EQFP
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 79 608256 22320 144-LQFP Exposed Pad

Quantity 1,063 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case144-LQFP Exposed PadNumber of I/O79Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1395Number of Logic Elements/Cells22320
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits608256

Overview of EP4CE22E22A7N – Cyclone® IV E FPGA IC, 79 I/Os, 22,320 Logic Elements, 144-LQFP

The EP4CE22E22A7N is a Cyclone® IV E field-programmable gate array (FPGA) provided in a 144-LQFP exposed pad package for surface-mount applications. It integrates 22,320 logic elements and approximately 0.61 Mbits of embedded memory to implement custom digital logic, buffering and control functions.

Designed and qualified for automotive use (AEC‑Q100) and rated for operation from −40 °C to 125 °C, the device targets embedded and automotive designs that require programmable logic, moderate on-chip memory and a compact package footprint. The FPGA operates from a core supply of 1.15 V to 1.25 V and provides 79 user I/Os for external interfacing.

Key Features

  • Cyclone IV E FPGA core — Field-programmable architecture suitable for implementing custom digital logic and control functions.
  • Logic capacity — 22,320 logic elements to support medium-complexity designs and custom accelerators.
  • Embedded memory — Approximately 0.61 Mbits of on-chip RAM for data buffering, FIFOs and small lookup tables.
  • I/O resources — 79 user I/Os provided for sensor, actuator and peripheral interfacing.
  • Power supply — Core voltage supply range 1.15 V to 1.25 V.
  • Package & mounting — 144-LQFP exposed pad (supplier device package: 144‑EQFP, 20×20), surface-mount package for compact board layouts.
  • Automotive qualification — Grade: Automotive with AEC‑Q100 qualification for designs requiring automotive-grade components.
  • Extended temperature range — Operating temperature range from −40 °C to 125 °C for harsh-environment applications.
  • Environmental compliance — RoHS compliant.

Typical Applications

  • Automotive control systems — Implement vehicle control logic, safety-related glue logic or peripheral interfacing where AEC‑Q100 qualification and extended temperature operation are required.
  • Embedded control and state machines — Realize custom control, sequencing and deterministic logic using the device’s 22,320 logic elements and on-chip memory.
  • Sensor interfacing and preprocessing — Use available I/Os and embedded RAM for data capture, buffering and simple preprocessing at the edge.

Unique Advantages

  • Automotive-qualified component: AEC‑Q100 qualification and automotive grade simplify selection for vehicle electronics and reduce qualification overhead.
  • Compact surface-mount package: 144-LQFP exposed pad supports space-constrained PCB designs while providing thermal conduction through the exposed pad.
  • Balanced logic and memory: 22,320 logic elements paired with approximately 0.61 Mbits of embedded RAM enable a wide range of control and buffering tasks without external memory.
  • Wide operating temperature: −40 °C to 125 °C rating supports deployment in harsh and variable-temperature environments.
  • Flexible I/O count: 79 user I/Os allow direct interfacing to sensors, actuators and peripheral buses.
  • Low-voltage core operation: 1.15 V to 1.25 V supply supports designs targeting lower core power domains.

Why Choose EP4CE22E22A7N?

The EP4CE22E22A7N offers a practical balance of programmable logic, embedded memory and I/O in a compact, automotive‑qualified package. Its Cyclone IV E architecture and 22,320 logic elements make it suitable for engineers implementing medium-complexity logic, deterministic control and sensor interfacing in environments that demand extended temperature performance.

This part is a fit for teams seeking a qualified, field-programmable solution with on-chip memory and a proven package format, delivering design flexibility and robustness for automotive and embedded applications.

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