EP4CE22F17C8N

The EP4CE22F17C8N is an Intel Cyclone® IV E field programmable gate array (FPGA) supplied in a 256-ball low-profile BGA package. It provides 22,320 logic elements and approximately 0.61 Mbits of on-chip RAM for implementing custom digital logic in commercial embedded designs.

Configured for surface-mount assembly, this commercial-grade FPGA supports a core supply range of 1.15 V to 1.25 V and an operating temperature range of 0 °C to 85 °C, making it suitable for a wide range of standard commercial applications that require programmable logic and flexible I/O.

Key Features

• Core Logic 22,320 logic elements provide substantial programmable logic resources for custom digital functions and mid-density designs.
• Embedded Memory Approximately 0.61 Mbits of on-chip RAM (608,256 bits) for data buffering, FIFOs, and small memory structures directly within the fabric.
• I/O Capacity 153 general-purpose I/O pins enable medium-density external interfacing and peripheral connectivity.
• Package & Mounting 256-ball LBGA package (supplier device package listed as 256-FBGA, 17×17) in a surface-mount form factor for compact board integration.
• Power Core supply operating range of 1.15 V to 1.25 V to match system power domains and voltage rails.
• Thermal & Grade Commercial-grade device with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Standards & Compliance RoHS compliant, supporting regulatory requirements for lead-free assembly.
• Documentation Device is part of the Cyclone IV family with extended device handbook and datasheet material covering operating conditions, DC characteristics, switching characteristics, and device-level guidance.

Typical Applications

• Commercial Embedded Systems Integrate custom logic, protocol handling, or control functions in space-constrained commercial products using the 256-LBGA package and surface-mount mounting.
• Interface and Peripheral Bridging Use the 153 I/O pins for medium-density signal translation and peripheral aggregation between processors and external devices.
• Prototyping and Custom IP Development Leverage the programmable logic and embedded RAM for developing and validating custom IP and digital functions in a Cyclone IV E device.

Unique Advantages

• Substantial Logic Capacity: 22,320 logic elements provide a balance of integration and cost for mid-range programmable designs.
• On-Chip Memory for Local Storage: Approximately 0.61 Mbits of embedded RAM reduces external memory dependencies for buffering and small data structures.
• Flexible I/O Count: 153 I/Os support a variety of peripheral and interface requirements without immediate need for external I/O expanders.
• Compact Surface-Mount Package: 256-LBGA (supplier 256-FBGA, 17×17) enables high-density board layouts while keeping board area small.
• Commercial Temperature Range: Rated 0 °C to 85 °C to meet the thermal requirements of standard commercial deployments.
• Regulatory Compliance: RoHS compliance supports lead-free assembly requirements and simplifies supply-chain compliance.

Why Choose EP4CE22F17C8N?

The EP4CE22F17C8N delivers a practical combination of programmable logic capacity, embedded memory, and medium I/O count in a compact 256-ball BGA package—suitable for commercial embedded applications that require flexible, on-board logic implementation. Its documented operating conditions and device handbook material support design validation and system-level integration.

This device is a fit for engineers and product teams seeking a Cyclone IV E FPGA with clearly specified electrical and thermal ranges, RoHS compliance, and a package optimized for surface-mount assembly. It provides a scalable option for mid-density FPGA designs where integration and board area are priorities.

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