EP4CE22F17C9L

IC FPGA 153 I/O 256FBGA
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 153 608256 22320 256-LBGA

Quantity 135 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O153Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1395Number of Logic Elements/Cells22320
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits608256

Overview of EP4CE22F17C9L – Cyclone® IV E Field Programmable Gate Array (FPGA) IC, 153 I/O, 22,320 Logic Elements, 256-LBGA

The EP4CE22F17C9L is a Cyclone® IV E field programmable gate array from Intel, delivering programmable logic resources in a compact 256-LBGA package. It provides a balance of logic capacity, on-chip memory and I/O count for commercial embedded and system-level designs.

Key technical attributes include 22,320 logic elements, approximately 0.608 Mbits of embedded memory, a 153-pin I/O complement, and a low-voltage core supply range. This combination supports designs that require moderate logic density and flexible I/O in a surface-mount BGA footprint.

Key Features

  • Core Logic  22,320 logic elements provide substantial programmable logic capacity for state machines, glue logic, and custom datapaths.
  • On-chip Memory  Approximately 0.608 Mbits of embedded RAM for FIFOs, buffering, and local storage without external memory.
  • I/O Density  153 general-purpose I/Os enable broad external connectivity for peripherals, sensors, and bus interfaces.
  • Low-Voltage Core  Core supply range from 970 mV to 1.03 V, suitable for power-optimized FPGA designs.
  • Package & Mounting  256-LBGA package (supplier device package: 256-FBGA, 17×17) for compact surface-mount PCB integration.
  • Operating Conditions & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant for environmental regulatory alignment.
  • Documentation  Device is part of the Cyclone IV E family and referenced in the Cyclone IV Device Handbook, Volume 3 for detailed electrical and timing specifications.

Unique Advantages

  • Balanced Logic and Memory: 22,320 logic elements paired with ~0.608 Mbits of embedded RAM allows designers to implement complex logic with local storage on a single device.
  • Generous I/O Count: With 153 I/Os, the device supports multiple interfaces and peripherals without immediate need for external I/O expansion.
  • Compact BGA Form Factor: The 256-LBGA (17×17) package enables high-density PCB layouts while maintaining surface-mount manufacturability.
  • Power-Conscious Core: A narrow core voltage window (970 mV–1.03 V) supports low-voltage system designs and predictable power rails.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match a wide range of commercial and embedded application environments.
  • Regulatory Compliance: RoHS compliance reduces regulatory risk and simplifies product compliance planning.

Why Choose EP4CE22F17C9L?

The EP4CE22F17C9L offers a practical combination of logic density, embedded memory and I/O capability in a compact 256-LBGA package from the Cyclone IV E family. Its low-voltage core and commercial temperature rating make it suitable for a variety of embedded and system-level designs that require on-chip programmable logic and moderate memory capacity.

Backed by the Cyclone IV Device Handbook documentation, the device is a well-documented option for engineers seeking a commercially graded FPGA from Intel with clear electrical and timing guidance for system integration.

Request a quote or submit pricing and availability details for EP4CE22F17C9L to begin integrating this Cyclone IV E FPGA into your next design.

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