EP4CE22F17I8L

The EP4CE22F17I8L is an Intel Cyclone® IV E FPGA in a 256-LBGA package optimized for industrial applications. It provides a fabric of 22,320 logic elements and approximately 0.61 Mbits of embedded memory, delivering a balance of integration and configurability for mid-density digital designs.

Designed for industrial temperature ranges, the device supports a wide range of embedded logic, I/O interfacing and on-chip memory use cases where predictable operating conditions and compact surface-mount packaging are required.

Key Features

• Logic Capacity — 22,320 logic elements for implementing custom digital functions, state machines, and glue logic.
• Embedded Memory — Approximately 0.61 Mbits of on-chip RAM (608,256 bits) for FIFOs, buffering, and small data stores.
• I/O Resources — 153 user I/O pins to support a variety of peripheral and parallel interfaces.
• Power — Core voltage supply range of 0.97 V to 1.03 V (970 mV to 1.03 V) to match platform power rails and support stable core operation.
• Package & Mounting — 256-LBGA package (supplier package: 256-FBGA, 17×17) with surface-mount mounting for compact PCB designs.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for industrial-environment electronics.
• Regulatory — RoHS compliant for environmental and regulatory alignment.
• Documentation — Device handbook and datasheet include detailed sections on operating conditions, DC characteristics, power consumption, switching characteristics, and I/O specifications to support engineering evaluation and design.

Typical Applications

• Industrial Control — Implement custom motor control logic, sensor aggregation, and deterministic I/O handling within industrial controllers operating across extended temperature ranges.
• Communications & Bridging — Provide protocol translation, packet buffering, and parallel-interface bridging using on-chip logic and embedded RAM.
• Embedded System Glue Logic — Replace multiple discrete components by consolidating address decoding, bus interfaces, and custom peripherals into a single FPGA fabric.

Unique Advantages

• Balanced Logic and Memory: 22,320 logic elements paired with ~0.61 Mbits of embedded RAM lets designers implement both control logic and local buffering without external memory for many mid-density applications.
• Deterministic I/O Capacity: 153 I/O pins provide the flexibility to connect multiple peripherals and parallel interfaces directly to the FPGA fabric.
• Industrial Thermal Range: Rated from −40 °C to 100 °C to accommodate harsher operating environments commonly found in industrial deployments.
• Compact Surface-Mount Packaging: 256-LBGA (256-FBGA, 17×17) enables high-density PCB layouts while preserving accessibility to a large number of I/Os.
• Standards Compliance: RoHS compliance supports regulatory and environmental requirements for modern electronic products.
• Comprehensive Technical Reference: The Cyclone IV device handbook and datasheet provide the technical detail engineers need for system integration, including power, timing and I/O specifications.

Why Choose EP4CE22F17I8L?

The EP4CE22F17I8L offers a practical mix of logic capacity, on-chip memory and I/O density in a compact, industrial-grade package. It is appropriate for engineers seeking a configurable, surface-mount FPGA platform that can operate across extended temperatures and integrate a variety of system functions.

For design teams targeting mid-density embedded systems, communications bridging, or industrial control applications, this Cyclone IV E device provides verifiable specifications and supporting documentation to streamline evaluation and integration into production designs.

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