EP4CE22U14I7N
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 153 608256 22320 256-LFBGA |
|---|---|
| Quantity | 1,276 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-UBGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 153 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1395 | Number of Logic Elements/Cells | 22320 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 608256 |
Overview of EP4CE22U14I7N – Cyclone® IV E Field Programmable Gate Array, 22,320 logic elements, 153 I/O, 256‑LFBGA
The EP4CE22U14I7N is a Cyclone® IV E Field Programmable Gate Array supplied in a compact 256‑LFBGA package. It delivers 22,320 logic elements and approximately 0.61 Mbits of embedded RAM to support mid‑density programmable logic and memory requirements.
Built for industrial environments, this surface‑mount FPGA provides 153 user I/Os, an industrial operating temperature range, and a defined core voltage range, making it suitable for designs that require deterministic logic capacity, moderate embedded memory, and robust temperature tolerance.
Key Features
- Logic Capacity 22,320 logic elements (cells) to implement custom logic, state machines, and glue‑logic functions.
- Embedded Memory Approximately 0.61 Mbits of on‑chip RAM for buffering, FIFOs, and small data structures.
- I/O Density 153 general‑purpose I/O pins to support multiple interfaces and peripherals without external IO expanders.
- Package and Mounting 256‑LFBGA (supplier device package: 256‑UBGA 14×14) in a surface‑mount form factor for space‑constrained PCB layouts.
- Power Core supply voltage range of 1.15 V to 1.25 V to match system power rails and design constraints.
- Industrial Temperature Rating Specified operating range from −40 °C to 100 °C for use in industrial temperature environments.
- Environmental Compliance RoHS compliant to meet common environmental and regulatory requirements.
Typical Applications
- Industrial Control Use the industrial‑grade temperature range and logic capacity to implement control, sequencing, and interface functions in industrial automation equipment.
- I/O‑Intensive Interface Bridging Leverage 153 I/Os to consolidate multiple peripheral interfaces and protocol bridging on a single device.
- Embedded Logic and Buffering Combine 22,320 logic elements with on‑chip RAM for data buffering, custom packet handling, or control functions in embedded systems.
Unique Advantages
- Balanced Logic and Memory: 22,320 logic elements paired with approximately 0.61 Mbits of RAM provide a versatile resource mix for mid‑range programmable designs.
- High I/O Count: 153 available I/Os reduce the need for external multiplexers or expanders, simplifying board-level design.
- Industrial Reliability: An operating temperature range of −40 °C to 100 °C supports deployment in demanding environments.
- Compact Surface‑Mount Package: The 256‑LFBGA (14×14 UBGA footprint) enables high‑density PCBs while keeping the device footprint modest.
- Controlled Core Voltage: A defined 1.15–1.25 V supply window simplifies power supply design and integration.
- RoHS Compliant: Meets common environmental compliance standards for lead‑free manufacturing.
Why Choose EP4CE22U14I7N?
The EP4CE22U14I7N positions itself as a mid‑density Cyclone IV E FPGA that combines a substantial logic fabric with embedded RAM and a high I/O count in a compact 256‑LFBGA package. Its industrial temperature rating and RoHS compliance make it a practical choice for industrial and embedded applications that require deterministic programmable logic and reliable operation across a wide temperature range.
This device is well suited for engineers designing compact, I/O‑rich systems that need a controlled core voltage domain and moderate on‑chip memory. Its specification set supports designs where integration, predictable operating conditions, and board‑space efficiency are priorities.
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