EP4CE30F23C6

The EP4CE30F23C6 is an Intel Cyclone® IV E Field Programmable Gate Array (FPGA) IC in a 484-BGA package. It provides 28,848 logic elements, approximately 0.608 Mbits of embedded memory, and 328 user I/O pins in a 484-FBGA (23×23) footprint.

Commercial-grade and RoHS compliant, this device operates from a core supply of 1.15 V to 1.25 V and across an operating temperature range of 0 °C to 85 °C. Documentation for the Cyclone IV family, including device handbook material, is available to support design and system integration.

Key Features

• Core Logic  28,848 logic elements provide mid-range programmable logic capacity suitable for complex glue logic, control functions, and custom finite-state machines.
• Embedded Memory  Approximately 0.608 Mbits of on-chip RAM to implement buffers, small FIFOs, and local data storage within the FPGA fabric.
• I/O and Packaging  328 user I/Os delivered in a 484-FBGA (23×23) package (packaged as 484-BGA) for high-density board integration and flexible external interfacing.
• Power and Operating Conditions  Core supply voltage range of 1.15 V to 1.25 V; commercial operating temperature range of 0 °C to 85 °C. Surface-mount package simplifies modern PCB assembly flows.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly.
• Documentation  Supported by Cyclone IV device handbook material for detailed operating conditions, DC characteristics, power, and switching specifications.

Typical Applications

• Programmable logic and control  Implements custom control, protocol bridging, and glue logic where a combination of logic density and flexible I/O is required.
• Embedded buffering and local memory  Uses the on-chip memory for small buffering, FIFOs, and data staging close to logic resources.
• Board-level I/O interfacing  High I/O count supports parallel interfaces, custom peripherals, and prototyping of system I/O functions in a compact FBGA package.

Unique Advantages

• Balanced logic capacity: 28,848 logic elements enable substantial functionality while keeping device complexity manageable for mid-range designs.
• Integrated memory resources: Approximately 0.608 Mbits of embedded RAM reduces external memory dependency for small buffers and control-data storage.
• High I/O density: 328 user I/Os in a 484-FBGA (23×23) package supports rich external connectivity without large board area.
• Commercial-grade operation: Designed for 0 °C to 85 °C operation, matching many consumer and commercial embedded system thermal profiles.
• RoHS compliant: Facilitates lead-free manufacturing and meets common environmental directives.
• Documented device family: Cyclone IV device handbook material is available to guide design, power budgeting, and performance evaluation.

Why Choose EP4CE30F23C6?

The EP4CE30F23C6 positions itself as a commercially graded Cyclone® IV E FPGA offering a practical combination of logic density, embedded memory, and high I/O count in a 484-FBGA package. Its defined supply range (1.15 V–1.25 V), RoHS compliance, and documented device handbook support make it suitable for mid-range programmable designs requiring compact board-level integration.

This part is well suited to teams seeking a documented, mid-density FPGA solution for control logic, protocol interfacing, and embedded buffering tasks, with the package and I/O complement needed for space-constrained PCBs.

Request a quote or submit a parts inquiry today to evaluate EP4CE30F23C6 for your next FPGA-based design or procurement project.