EP4CE30F23C8

The EP4CE30F23C8 is a Cyclone® IV field-programmable gate array (FPGA) from Intel, presented in a 484-ball BGA package. It delivers mid-range programmable logic capacity and on-chip memory suited to commercial-grade digital designs that require a balance of logic density, I/O routing and power efficiency.

With 28,848 logic elements, approximately 0.61 Mbits of embedded RAM, and 328 I/O pins, this device targets applications that need configurable digital logic, high I/O connectivity and compact board-level integration while operating within a 1.15–1.25 V core supply range and a 0 °C to 85 °C commercial temperature window.

Key Features

• Logic Capacity  28,848 logic elements provide substantial resource density for mid-range programmable logic implementations.
• Embedded Memory  Approximately 0.61 Mbits of on-chip RAM for buffering, distributed storage and state machines.
• I/O Density  328 user I/O pins enable complex interfacing and multiple parallel connections on a single device.
• Package and Mounting  Supplied in a 484-BGA / 484-FBGA (23×23) package for compact, surface-mount board designs.
• Power  Core voltage operating range of 1.15 V to 1.25 V to match system power rails and regulator designs.
• Operating Grade and Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS-compliant manufacturing and materials.

Typical Applications

• Custom Digital Logic  Implement application-specific state machines, protocol handlers and glue logic using on-chip logic elements and RAM.
• I/O-Intensive Interfaces  Support boards and modules that require numerous parallel or mixed-signal interfaces with the device’s 328 I/O pins.
• Embedded System Control  Integrate control and sequencing functions in compact commercial products operating within standard temperature ranges.

Unique Advantages

• High Logic Density: 28,848 logic elements enable substantial custom logic implementation without escalating board count.
• On-Chip Memory for Efficient Designs: Approximately 0.61 Mbits of embedded RAM reduces dependence on external memory for many buffering and buffering-related tasks.
• Large I/O Count: 328 I/O pins allow flexible system partitioning and multiple peripheral connections from a single FPGA.
• Compact BGA Footprint: The 484-BGA (484-FBGA, 23×23) package supports compact, surface-mount assemblies for space-constrained commercial products.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C, aligning with typical commercial embedded applications.
• Regulatory Compliance: RoHS-compliant construction supports environmentally conscious product designs.

Why Choose EP4CE30F23C8?

The EP4CE30F23C8 positions itself as a practical Cyclone IV FPGA option for designers seeking a balance of logic resources, embedded memory and high I/O count in a compact BGA package. Its commercial-grade operating range and RoHS compliance make it suitable for a wide range of standard embedded and digital interface applications.

Designed for teams developing mid-range programmable logic solutions, this device supports integration and scalability within commercial product lines while providing clear, specification-driven selection criteria for procurement and system design.

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