EP4CE30F23C9L

The EP4CE30F23C9L is an Intel Cyclone IV E Field Programmable Gate Array (FPGA) supplied in a 484‑FBGA (23×23) surface‑mount package. It provides on‑chip programmable logic resources, embedded memory, and a substantial I/O count in a compact commercial‑grade device.

Key silicon characteristics include 28,848 logic elements, 1,803 logic array blocks (LABs), approximately 0.61 Mbits of embedded memory, and 328 user I/O pins, with a core voltage range of 0.97 V to 1.03 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 28,848 logic elements organized across 1,803 logic array blocks (LABs) for implementing custom digital logic and state machines.
• Embedded Memory — Approximately 0.61 Mbits of on‑chip RAM for buffering, FIFOs, and small data storage without external memory.
• High I/O Count — 328 user I/O pins to support parallel interfaces, bus interconnects, and mixed peripheral connections.
• Package and Mounting — 484‑FBGA (23×23) package in a surface‑mount form factor for compact board integration.
• Power and Operating Range — Core supply range from 0.97 V to 1.03 V and commercial operating temperature range of 0 °C to 85 °C.
• Commercial Grade — Rated for commercial applications per the supplied grade information.

Typical Applications

• Custom digital logic — Implement programmable logic functions and control logic leveraging 28,848 logic elements and 1,803 LABs.
• I/O‑intensive interfaces — Route multiple parallel and serial interfaces using up to 328 user I/O pins for board‑level bridging and protocol adaptation.
• Embedded system glue and peripherals — Use the FPGA’s embedded memory and logic resources to handle buffering, peripheral control, and configurable data paths.

Unique Advantages

• Balanced logic and memory — 28,848 logic elements combined with approximately 0.61 Mbits of embedded RAM provide a balanced resource set for mid‑scale designs.
• Generous I/O availability — 328 user I/O pins simplify integration with external devices and multiple bus interfaces, reducing the need for external I/O expanders.
• Compact surface‑mount package — 484‑FBGA (23×23) package saves PCB area while maintaining thermal and electrical connectivity for board‑level designs.
• Tight core voltage specification — Core supply range of 0.97 V to 1.03 V enables predictable power provisioning and design margining.
• Commercial operating range — 0 °C to 85 °C rating aligns with standard commercial applications and environments.
• Vendor documentation — Detailed device handbook and datasheet information are available for electrical, timing, and packaging specifications to support design and validation.

Why Choose EP4CE30F23C9L?

The EP4CE30F23C9L delivers a practical combination of logic density, embedded memory, and I/O capacity in a compact 484‑FBGA surface‑mount package from Intel’s Cyclone IV E family. Its specification set—28,848 logic elements, roughly 0.61 Mbits of on‑chip RAM, 328 I/Os, and defined core voltage and temperature ranges—supports a wide range of commercial FPGA tasks where mid‑scale programmability and board‑level integration are required.

Design teams seeking a commercially graded Cyclone IV E device with clear electrical and packaging specifications will find the EP4CE30F23C9L suited to designs that require configurable logic, moderate embedded memory, and extensive I/O without moving to larger device classes.

Request a quote or submit an inquiry for pricing and availability for the EP4CE30F23C9L. Our team will provide lead‑time and purchasing information to support your project planning.