EP4CE30F23I7N

The EP4CE30F23I7N is a Cyclone IV E family FPGA IC from Intel, offering a mid-range programmable logic solution in a 484-ball FBGA package. It provides a substantial logic fabric and on-chip memory for industrial applications that require configurable digital logic, parallel datapath implementation, and flexible I/O connectivity.

Designed for surface-mount assembly and rated for industrial temperatures, this device balances integration and thermal robustness while operating from a core supply between 1.15 V and 1.25 V.

Key Features

• Core Logic  28,848 logic elements for implementing custom digital functions and parallel processing tasks.
• Logic Array Capacity  Sufficient resources to support medium-complexity designs with a high degree of configurability.
• On-Chip Memory  Approximately 0.6 Mbits of embedded RAM to store buffers, state machines, and small data sets without external memory.
• GPIO and Interfaces  328 user I/O pins to support multiple interfaces, sensor connections, and board-level integration.
• Power Supply  Core voltage range of 1.15 V to 1.25 V to match system power-rail requirements and support controlled power sequencing.
• Package and Mounting  484-ball FBGA (23 × 23) in a surface-mount package for dense board layouts and reliable solder joints.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation, suitable for industrial environments and extended-temperature deployments.
• Environmental Compliance  RoHS compliant to meet common lead-free manufacturing requirements.

Typical Applications

• Industrial Control  Implement real-time control logic, sensor interfacing, and custom timing for factory automation and process control equipment.
• Embedded Systems  Provide glue logic, custom peripherals, and parallel data paths for compact embedded platforms and development prototypes.
• Communications and Networking  Support protocol handling, packet processing, and interface bridging where flexible, reconfigurable logic is required.

Unique Advantages

• High Logic Density: 28,848 logic elements enable complex control and datapath implementations without immediate need for external programmable devices.
• On-Chip Memory: Approximately 0.6 Mbits of embedded RAM reduces dependence on external RAM for buffering and small data storage.
• Extensive I/O Count: 328 I/O pins allow broad connectivity for sensors, actuators, and multiple high-speed or parallel interfaces.
• Industrial Temperature Rating: Operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
• Compact, Surface-Mount Package: 484-FBGA (23 × 23) supports dense PCB designs and automated assembly for volume production.
• Regulatory Readiness: RoHS compliance simplifies integration into lead-free manufacturing flows.

Why Choose EP4CE30F23I7N?

The EP4CE30F23I7N delivers a balanced combination of logic capacity, on-chip memory, and a high I/O count in a compact 484-ball FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for robust, production-level designs that need field-programmable flexibility.

This device is well suited to engineers and teams building mid-complexity FPGA-based systems—particularly for industrial automation, embedded platform development, and communications interface tasks—where reliable operation across a wide temperature range and a dense I/O footprint are important considerations.

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