EP4CE30F23C9LN
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 328 608256 28848 484-BGA |
|---|---|
| Quantity | 1,217 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 328 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1803 | Number of Logic Elements/Cells | 28848 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 608256 |
Overview of EP4CE30F23C9LN – Cyclone® IV Field Programmable Gate Array (FPGA) IC 328 608256 28848 484-BGA
The EP4CE30F23C9LN is a Cyclone® IV FPGA from Intel, delivered in a 484-ball FBGA (23×23) package for surface-mount applications. This commercial-grade device provides a mid-range logic capacity and on-chip memory suitable for a variety of FPGA-based designs.
Designed for commercial temperature operation, the device combines a core supply voltage range of 0.970 V to 1.03 V with 32,848 logic resources including 28,848 logic elements and 328 user I/O pins, enabling compact, low-voltage FPGA implementations.
Key Features
- Core Architecture Cyclone® IV family FPGA architecture with core supply operating between 0.970 V and 1.03 V for low-voltage designs.
- Logic Capacity 28,848 logic elements to implement mid-range digital logic and control functions.
- Embedded Memory Approximately 0.608 Mbits of on-chip RAM for packet buffering, state storage, or small lookup tables.
- I/O and Package 328 user I/O pins in a 484-FBGA (23×23) package, optimized for high pin-count interfaces in a compact BGA footprint.
- Physical and Mounting Surface-mount 484-BGA package designed for PCB assembly; supplier device package listed as 484-FBGA (23×23).
- Commercial Temperature and Compliance Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
Unique Advantages
- Balanced logic and memory capacity: 28,848 logic elements paired with approximately 0.608 Mbits of embedded RAM provides a practical balance for control, signal processing, and glue-logic tasks.
- High I/O count in a compact package: 328 I/Os in a 484-FBGA (23×23) package supports multi-channel interfacing while conserving PCB area.
- Low-voltage core: Core supply specified from 0.970 V to 1.03 V helps designs targeting reduced power consumption at the FPGA core.
- Commercial temperature rating: Rated for 0 °C to 85 °C operation, matching typical commercial product environments.
- RoHS compliant: Meets RoHS requirements for environmental and regulatory compatibility.
Why Choose EP4CE30F23C9LN?
The EP4CE30F23C9LN provides a mid-range Cyclone® IV FPGA option for commercial designs that require substantial logic density, a notable on-chip RAM capacity, and a high count of user I/Os in a compact 484-FBGA package. Its low-voltage core specification and RoHS compliance make it suitable for modern, power-conscious commercial applications.
With documentation and device handbook support available from the Cyclone IV family, this part is positioned for engineering teams developing FPGA-based control, interface, and processing functions where a balance of integration and manufacturability is required.
Request a quote or submit a pricing inquiry for the EP4CE30F23C9LN to receive availability and lead-time information tailored to your project requirements.

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