EP4CE30F23C9LN

IC FPGA 328 I/O 484FBGA
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 328 608256 28848 484-BGA

Quantity 1,217 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O328Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1803Number of Logic Elements/Cells28848
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits608256

Overview of EP4CE30F23C9LN – Cyclone® IV Field Programmable Gate Array (FPGA) IC 328 608256 28848 484-BGA

The EP4CE30F23C9LN is a Cyclone® IV FPGA from Intel, delivered in a 484-ball FBGA (23×23) package for surface-mount applications. This commercial-grade device provides a mid-range logic capacity and on-chip memory suitable for a variety of FPGA-based designs.

Designed for commercial temperature operation, the device combines a core supply voltage range of 0.970 V to 1.03 V with 32,848 logic resources including 28,848 logic elements and 328 user I/O pins, enabling compact, low-voltage FPGA implementations.

Key Features

  • Core Architecture  Cyclone® IV family FPGA architecture with core supply operating between 0.970 V and 1.03 V for low-voltage designs.
  • Logic Capacity  28,848 logic elements to implement mid-range digital logic and control functions.
  • Embedded Memory  Approximately 0.608 Mbits of on-chip RAM for packet buffering, state storage, or small lookup tables.
  • I/O and Package  328 user I/O pins in a 484-FBGA (23×23) package, optimized for high pin-count interfaces in a compact BGA footprint.
  • Physical and Mounting  Surface-mount 484-BGA package designed for PCB assembly; supplier device package listed as 484-FBGA (23×23).
  • Commercial Temperature and Compliance  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Unique Advantages

  • Balanced logic and memory capacity: 28,848 logic elements paired with approximately 0.608 Mbits of embedded RAM provides a practical balance for control, signal processing, and glue-logic tasks.
  • High I/O count in a compact package: 328 I/Os in a 484-FBGA (23×23) package supports multi-channel interfacing while conserving PCB area.
  • Low-voltage core: Core supply specified from 0.970 V to 1.03 V helps designs targeting reduced power consumption at the FPGA core.
  • Commercial temperature rating: Rated for 0 °C to 85 °C operation, matching typical commercial product environments.
  • RoHS compliant: Meets RoHS requirements for environmental and regulatory compatibility.

Why Choose EP4CE30F23C9LN?

The EP4CE30F23C9LN provides a mid-range Cyclone® IV FPGA option for commercial designs that require substantial logic density, a notable on-chip RAM capacity, and a high count of user I/Os in a compact 484-FBGA package. Its low-voltage core specification and RoHS compliance make it suitable for modern, power-conscious commercial applications.

With documentation and device handbook support available from the Cyclone IV family, this part is positioned for engineering teams developing FPGA-based control, interface, and processing functions where a balance of integration and manufacturability is required.

Request a quote or submit a pricing inquiry for the EP4CE30F23C9LN to receive availability and lead-time information tailored to your project requirements.

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