EP4CE30F23I8LN

The EP4CE30F23I8LN is an Intel Cyclone® IV E field-programmable gate array (FPGA) supplied in a 484-ball BGA package. It delivers a balance of programmable logic density, on-chip memory, and I/O count for industrial-grade embedded designs.

With a core supply range specified between 0.970 V and 1.03 V and an operating temperature range from -40 °C to 100 °C, this device targets industrial applications that require robust operation and significant I/O connectivity.

Key Features

• Core Logic — 28,848 logic elements providing programmable combinational and sequential resources for custom logic and control implementations.
• Embedded Memory — 608,256 bits of on-chip RAM (approximately 0.61 Mbits) to support buffering, lookup tables, and small-data storage without external memory.
• I/O Capacity — 328 user I/O pins to interface with sensors, actuators, peripherals and system buses.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C to meet industrial environment requirements.
• Power — Core voltage supply range of 0.970 V to 1.03 V for the FPGA core.
• Package & Mounting — 484-ball FBGA (23 × 23) in a surface-mount package for compact board-level integration.
• Compliance — RoHS compliant for environmental and regulatory considerations.
• Documentation — Supported by a Cyclone IV device handbook covering operating conditions, DC characteristics, switching specifications and other device-level details.

Typical Applications

• Industrial Control — Industrial-grade temperature range and a high I/O count make this FPGA suitable for motor control, PLC logic and machine interface tasks requiring reliable operation in harsh environments.
• Embedded Systems — Large logic capacity and on-chip RAM enable custom embedded processing, glue-logic integration and protocol bridging within compact systems.
• Communications and Networking — The combination of logic density and numerous I/Os supports packet processing, interface adaptation, and control-plane functions in communications equipment.

Unique Advantages

• High Logic Density: 28,848 logic elements provide substantial programmable resources to implement complex state machines, datapaths and control logic on a single device.
• Integrated On-Chip Memory: Approximately 0.61 Mbits of embedded RAM reduces reliance on external memory for buffering and fast local storage.
• Extensive I/O: 328 user I/Os enable broad connectivity to sensors, peripherals and system buses, simplifying board-level design.
• Industrial Robustness: Specified operation from -40 °C to 100 °C and industrial-grade classification support deployment in demanding environments.
• Compact Package: 484-FBGA (23×23) surface-mount package allows dense integration while maintaining a high pin count for system connectivity.
• Regulatory Compliance: RoHS compliance supports eco-conscious product designs and regulatory requirements.

Why Choose EP4CE30F23I8LN?

The EP4CE30F23I8LN positions itself as a versatile Cyclone IV E FPGA option for industrial and embedded applications that require a balance of logic capacity, on-chip memory and substantial I/O. Its specified voltage and temperature ranges, together with the 484-BGA package, make it well suited for compact, robust system designs where board space and environmental tolerance matter.

This device is a practical choice for engineers needing a programmable logic device that provides clear, verifiable hardware resources—logic elements, embedded RAM and I/O—backed by comprehensive device documentation for electrical and timing characterization.

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