EP4CE30F29C7N

The EP4CE30F29C7N is a Cyclone® IV E field-programmable gate array (FPGA) from Intel. It provides a medium-density FPGA core with 28,848 logic elements, approximately 0.608 Mbits of embedded memory, and 532 user I/O pins in a 780-FBGA (29×29) package.

Designed for commercial-grade systems, this device delivers a balance of logic capacity, on-chip memory and high I/O count for board-level integration where flexible programmable logic is required. Core supply voltage is specified at 1.15 V to 1.25 V, and the operating temperature range is 0 °C to 85 °C.

Key Features

• Core Logic  Provides 28,848 logic elements for implementing custom digital logic, control functions and moderate-sized accelerators.
• Logic Blocks (CLBs)  Contains 1,803 configurable logic blocks (CLBs) to structure combinational and sequential logic resources.
• Embedded Memory  Approximately 0.608 Mbits of on-chip RAM to support buffers, FIFOs and small data stores without external memory.
• I/O Resources  532 user I/O pins enable extensive parallel interfacing to peripherals, sensors and external logic devices.
• Power  Core voltage defined at 1.15 V to 1.25 V for integration with common FPGA power domains.
• Package & Mounting  780-ball FBGA (29×29) surface-mount package for compact board-level placement and high pin density.
• Operating Conditions  Commercial-grade operation from 0 °C to 85 °C to suit a wide range of consumer and commercial applications.
• RoHS Compliance  Meets RoHS requirements for lead-free manufacturing and regulatory compliance in applicable regions.

Typical Applications

• Embedded Control and Logic  Implement custom control, glue logic and timing-critical functions using the device’s logic elements and CLB structure.
• High-Density I/O Interfaces  Support parallel sensor arrays, multi-channel data capture or board-to-board interfaces with 532 available I/O pins.
• Prototyping and Development  Use as a platform for validating digital designs, IP cores and system integration before production.
• Consumer and Commercial Electronics  Integrate programmable logic into products that require moderate logic capacity and on-chip memory within a compact BGA footprint.

Unique Advantages

• High I/O Density: 532 I/O pins provide flexibility for complex interfacing and multi-channel connectivity, reducing the need for external multiplexing.
• Balanced Logic and Memory: 28,848 logic elements combined with approximately 0.608 Mbits of RAM support both control-oriented designs and small data buffering on-chip.
• Compact BGA Package: The 780-FBGA (29×29) package enables high pin-count routing in a space-efficient footprint for board-level integration.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to meet typical commercial and consumer product environments.
• Standards-Friendly Manufacturing: RoHS-compliant construction supports lead-free assembly processes and regulatory alignment.
• Well-Documented Family: Part of the Cyclone IV device family with accompanying device handbook and datasheet references for design guidance.

Why Choose EP4CE30F29C7N?

The EP4CE30F29C7N positions itself as a flexible, medium-density Cyclone IV E FPGA option for commercial designs that require a combination of substantial logic resources, on-chip memory and a large number of I/O signals in a compact BGA package. Its specified core voltage and commercial temperature rating make it suitable for consumer and general-purpose embedded applications.

This device is appropriate for teams and projects needing scalable programmable logic with clear specification points—logic capacity, embedded RAM, I/O count, package footprint and operating conditions—backed by Cyclone IV family documentation.

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