EP4CE30F29C8L

The EP4CE30F29C8L is a Cyclone IV E field programmable gate array (FPGA) in a 780-ball fine-pitch BGA (29 × 29) package. It delivers 28,848 logic elements, approximately 0.608 Mbits of embedded memory and 532 user I/O pins, providing a compact, programmable platform for complex logic implementations.

Designed for commercial-grade applications, the device operates from a core supply range of 0.97 V to 1.03 V and is rated for 0 °C to 85 °C operation. The package and feature set make it suitable where high I/O count, significant logic capacity and on-chip memory are required in a surface-mount form factor.

Key Features

• Core Logic  Provides 28,848 logic elements for implementing custom digital logic, state machines and control functions.
• Embedded Memory  Approximately 0.608 Mbits of on-chip RAM for buffering, small data sets and local storage without external memory.
• High I/O Count  532 user I/O pins enable dense interfacing to peripherals, sensors, buses and parallel data paths.
• Package and Mounting  780-ball FBGA (29 × 29) surface-mount package for compact board integration and reliable soldered connections.
• Power  Core voltage supply range of 0.97 V to 1.03 V for predictable core operation within specified limits.
• Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C and RoHS compliance for environmental conformity.
• Documentation  Device is covered in the Cyclone IV device handbook and associated datasheet material for electrical, timing and packaging specifications.

Typical Applications

• I/O-dense interface bridging  Leverage 532 I/O pins to implement parallel interfaces, bus translators and multi-protocol glue logic within a single FPGA.
• Custom logic and control  Use the 28,848 logic elements to realize state machines, control pipelines and application-specific accelerators.
• Embedded buffering and small-data storage  On-chip RAM (approximately 0.608 Mbits) supports FIFO buffering, lookup tables and temporary data storage without external memory.
• Compact system integration  780-FBGA surface-mount packaging enables dense board layouts where board space is constrained.

Unique Advantages

• High logic capacity: 28,848 logic elements enable substantial programmable logic density for complex designs.
• Significant on-chip memory: Approximately 0.608 Mbits of embedded RAM reduces reliance on external memory for small to moderate data needs.
• Extensive I/O: 532 user I/O pins simplify integration with multiple peripherals and parallel interfaces, reducing external interface components.
• Compact package: 780-FBGA (29 × 29) balances high pin count with a compact board footprint for surface-mount assembly.
• Commercial temperature fit: Rated for 0 °C to 85 °C operation, appropriate for standard commercial environments and systems.
• RoHS compliant: Environmentally compliant manufacturing and materials for regulatory alignment.

Why Choose EP4CE30F29C8L?

The EP4CE30F29C8L delivers a combination of substantial logic resources, embedded memory and a very large I/O complement in a compact 780-FBGA package. Its defined core voltage range and commercial operating temperature make it suited to production systems and embedded equipment that require a programmable, high-density logic device.

This device is well suited for engineering teams seeking a programmable platform that consolidates multiple interfaces and custom logic into a single component, reducing board-level complexity while maintaining on-chip memory and I/O capacity.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for the EP4CE30F29C8L. Technical documentation is available for review to support design and integration.