EP4CE30F29C8

The EP4CE30F29C8 is a Cyclone IV field‑programmable gate array (FPGA) offered in a 780‑ball fine‑pitch BGA package. It delivers reconfigurable digital logic capability with 28,848 logic elements, approximately 0.61 Mbits of embedded RAM, and 532 general‑purpose I/Os in a commercial‑grade device.

Designed for commercial embedded applications, the device operates from a core supply of 1.15 V to 1.25 V, supports surface‑mount assembly in a 780‑FBGA (29×29) package, and is specified across a 0 °C to 85 °C operating range. Full technical details are documented in the Cyclone IV device handbook and accompanying datasheet materials.

Key Features

• Core logic  Provides 28,848 logic elements for implementing custom digital functions and control logic.
• Embedded memory  Includes 608,256 bits of on‑chip RAM (approximately 0.61 Mbits) for data buffering, FIFOs, and small on‑chip storage needs.
• I/O capacity  Up to 532 I/Os to support wide peripheral interfacing and board‑level connectivity.
• Power and supply  Specified core supply voltage range of 1.15 V to 1.25 V to match Cyclone IV power domains.
• Package and mounting  780‑FBGA (29×29) package in a surface‑mount form factor for high‑density PCB implementations.
• Commercial temperature grade  Rated for 0 °C to 85 °C operation for standard commercial applications.
• Regulatory compliance  RoHS compliant.
• Comprehensive documentation  Datasheet and Cyclone IV device handbook provide operating conditions, DC characteristics, ESD, power and switching specifications, and other design‑critical details.

Typical Applications

• Commercial embedded systems  Implement custom control and glue logic using 28,848 logic elements and broad I/O counts for board‑level integration.
• Prototyping and evaluation  Use the device’s reprogrammable fabric and on‑chip RAM for rapid hardware prototyping and algorithm validation.
• High‑density I/O designs  Leverage 532 I/Os in compact 780‑FBGA packaging where many external interfaces are required.

Unique Advantages

• High logic capacity  28,848 logic elements allow integration of substantial digital functionality into a single FPGA device, reducing external component count.
• On‑chip embedded RAM  Approximately 0.61 Mbits of RAM supports buffering, small memory blocks, and local storage without external memory.
• Large I/O count  532 I/Os enable flexible interfacing to peripherals, sensors, and other system components on dense PCBs.
• Compact, surface‑mount package  780‑FBGA (29×29) provides a high pin density in a space‑efficient footprint suitable for modern board designs.
• Commercial temperature and RoHS compliance  Specified 0 °C to 85 °C operation and RoHS conformance align the device to standard commercial production and environmental requirements.
• Documented device specifications  Extensive datasheet/handbook material covers operating conditions, DC characteristics, power consumption, and switching details to support design and qualification.

Why Choose EP4CE30F29C8?

The EP4CE30F29C8 positions itself as a commercially graded Cyclone IV FPGA option for designs that need substantial on‑chip logic, significant I/O capacity, and embedded RAM in a compact BGA package. Its defined core voltage range and documented electrical and thermal specifications make it suitable for integration into commercial embedded products and prototyping platforms.

Engineers selecting this part benefit from a combination of logic density, memory resources, and I/O count, backed by the Cyclone IV device handbook and datasheet information needed to plan power, signal, and thermal design decisions.

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