EP4CE30F29C7
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 532 608256 28848 780-BGA |
|---|---|
| Quantity | 822 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BGA | Number of I/O | 532 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1803 | Number of Logic Elements/Cells | 28848 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 608256 |
Overview of EP4CE30F29C7 – Cyclone® IV E Field Programmable Gate Array (FPGA)
The EP4CE30F29C7 is a Cyclone® IV E family field programmable gate array (FPGA) in a 780-ball BGA package, designed for commercial-grade programmable logic applications. It provides a balanced combination of logic capacity, I/O density and embedded memory for custom digital designs.
With 28,848 logic elements, 532 general‑purpose I/Os, and approximately 0.61 Mbits of on‑chip RAM, this device supports complex glue logic, protocol handling and mid-density integration while operating from a 1.15 V to 1.25 V core supply and a 0 °C to 85 °C ambient range.
Key Features
- Core Logic — 28,848 logic elements for implementing medium-complexity custom digital functions and state machines.
- Embedded Memory — Approximately 0.61 Mbits of on‑chip RAM to support buffering, FIFOs and small data structures without external memory.
- I/O Density — 532 I/O pins to support wide parallel interfaces, multiple peripherals or high-pin-count board designs.
- Power and Voltage — Core supply range of 1.15 V to 1.25 V to match system power rails and enable defined power budgeting.
- Package and Mounting — 780‑FBGA (29×29) package in a surface-mount form factor for high-density board integration.
- Operating Range and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
- Environmental Compliance — RoHS compliant for regulatory and assembly compatibility.
- Documentation and Support — Device is supported by Cyclone IV device handbook material covering operating conditions, DC characteristics, switching and power consumption details.
Typical Applications
- Custom Digital Logic and Glue — Use the device to implement protocol bridging, bus arbitration and custom control logic where programmable logic is required.
- Prototyping and Development — Medium-density logic and on‑chip RAM make the device suitable for early-stage hardware validation and firmware offload.
- Peripheral and Interface Control — High I/O count supports aggregation of parallel sensors, displays or interfaces in compact designs.
- Data Buffering and Small Memory Tasks — Embedded RAM provides local buffering for streaming data or temporary storage without external memory.
Unique Advantages
- Substantial Logic Capacity: 28,848 logic elements enable implementation of sizable custom functions without moving to higher-tier devices.
- High I/O Count: 532 I/Os reduce the need for external multiplexing, simplifying board routing for multi‑interface systems.
- On‑Chip Memory: Approximately 0.61 Mbits of embedded RAM supports buffering and temporary data storage, lowering BOM and board complexity.
- Compact, High‑Density Package: 780-FBGA (29×29) package provides many I/Os in a small footprint for space-constrained boards.
- Commercial‑Grade Reliability: Designed for standard commercial environments with a 0 °C to 85 °C operating range and RoHS compliance for manufacturability.
- Well‑Documented Family: Supported by Cyclone IV device handbook materials covering operating conditions, DC characteristics and switching behavior to aid design and validation.
Why Choose EP4CE30F29C7?
The EP4CE30F29C7 offers a balanced solution for designs that require significant programmable logic, a large number of I/Os and on‑chip RAM within a commercial‑grade FPGA. Its combination of 28,848 logic elements, approximately 0.61 Mbits of embedded memory and 532 I/Os in a 780‑FBGA package makes it well suited to mid-density digital integration tasks where board space and integration matter.
Engineers and procurement teams will find the EP4CE30F29C7 appropriate for applications needing flexible, field-programmable logic with clear electrical and environmental limits (1.15–1.25 V core supply; 0 °C to 85 °C operating range) and RoHS compliance for modern assembly processes.
Request a quote today to evaluate EP4CE30F29C7 for your next programmable logic design and to get pricing and availability details tailored to your requirements.

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