EP4CE30F29C6
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 532 608256 28848 780-BGA |
|---|---|
| Quantity | 372 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | Tray | Number of I/O | 532 | Voltage | 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | N/A | REACH Compliance | N/A | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 1803 | Number of Logic Elements/Cells | 28848 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 608256 |
Overview of EP4CE30F29C6 – Cyclone® IV E FPGA, 28,848 LEs, 532 I/Os, 780‑FBGA
The EP4CE30F29C6 is a Cyclone® IV E field programmable gate array (FPGA) IC from Intel. It integrates a substantial logic fabric and on-chip memory with a high I/O count in a compact 780‑FBGA package.
This device provides a clear set of hardware resources for embedded and digital design: 28,848 logic elements, approximately 0.61 Mbits of embedded memory, 532 user I/Os, and a single core supply of 1.15 V, in a commercial grade device rated for 0 °C to 85 °C.
Key Features
- Core Architecture Cyclone® IV E family FPGA architecture as specified for the EP4CE30F29C6 device.
- Logic Capacity 28,848 logic elements to implement custom digital logic and state machines.
- Embedded Memory Approximately 0.61 Mbits of on-chip RAM for buffering, FIFOs, and small data storage.
- I/O Resources 532 available I/O pins to support a wide range of peripheral interfaces and bus connections.
- Power Core voltage supply specified at 1.15 V.
- Package & Mounting 780‑FBGA (29×29) supplier device package in tray format, intended for surface-mount assembly.
- Operating Conditions & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Documentation Supported by a Cyclone IV device handbook and device datasheet detailing operating conditions, DC characteristics, switching characteristics, and other device-level specifications.
Unique Advantages
- High logic density: 28,848 logic elements enable complex custom logic and control functions without external ASICs.
- Substantial I/O count: 532 I/Os allow integration of numerous peripherals and parallel interfaces directly on-chip.
- On-chip memory for buffering: Approximately 0.61 Mbits of embedded RAM reduces reliance on external memory for small to moderate buffering needs.
- Compact BGA package: 780‑FBGA (29×29) provides a space-efficient footprint for high-density board designs.
- Single core supply: A clearly specified 1.15 V core rail simplifies power delivery design for the FPGA core.
- Commercial temperature rating: Rated 0 °C to 85 °C to match a wide range of standard electronic product environments.
Why Choose EP4CE30F29C6?
The EP4CE30F29C6 positions itself as a well-documented Cyclone® IV E FPGA option for designers needing a balance of logic capacity, embedded memory, and a high I/O count in a compact surface-mount BGA package. Its defined electrical and thermal parameters support predictable integration into commercial-grade designs.
This part is suited to teams and projects that require on-chip logic and memory density with abundant I/O, packaged for medium- to high-density PCB layouts, backed by device handbook and datasheet level documentation for system-level design and verification.
Request a quote or submit a quotation request to receive pricing and availability for the EP4CE30F29C6. Our team can provide ordering details, lead times, and packaging options.

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