EP4CE30F29C6

IC FPGA 532 I/O 780FBGA
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 532 608256 28848 780-BGA

Quantity 372 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / CaseTrayNumber of I/O532Voltage1.15 V
Mounting MethodSurface MountRoHS ComplianceN/AREACH ComplianceN/A
Moisture Sensitivity LevelN/ANumber of LABs/CLBs1803Number of Logic Elements/Cells28848
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits608256

Overview of EP4CE30F29C6 – Cyclone® IV E FPGA, 28,848 LEs, 532 I/Os, 780‑FBGA

The EP4CE30F29C6 is a Cyclone® IV E field programmable gate array (FPGA) IC from Intel. It integrates a substantial logic fabric and on-chip memory with a high I/O count in a compact 780‑FBGA package.

This device provides a clear set of hardware resources for embedded and digital design: 28,848 logic elements, approximately 0.61 Mbits of embedded memory, 532 user I/Os, and a single core supply of 1.15 V, in a commercial grade device rated for 0 °C to 85 °C.

Key Features

  • Core Architecture  Cyclone® IV E family FPGA architecture as specified for the EP4CE30F29C6 device.
  • Logic Capacity  28,848 logic elements to implement custom digital logic and state machines.
  • Embedded Memory  Approximately 0.61 Mbits of on-chip RAM for buffering, FIFOs, and small data storage.
  • I/O Resources  532 available I/O pins to support a wide range of peripheral interfaces and bus connections.
  • Power  Core voltage supply specified at 1.15 V.
  • Package & Mounting  780‑FBGA (29×29) supplier device package in tray format, intended for surface-mount assembly.
  • Operating Conditions & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Documentation  Supported by a Cyclone IV device handbook and device datasheet detailing operating conditions, DC characteristics, switching characteristics, and other device-level specifications.

Unique Advantages

  • High logic density: 28,848 logic elements enable complex custom logic and control functions without external ASICs.
  • Substantial I/O count: 532 I/Os allow integration of numerous peripherals and parallel interfaces directly on-chip.
  • On-chip memory for buffering: Approximately 0.61 Mbits of embedded RAM reduces reliance on external memory for small to moderate buffering needs.
  • Compact BGA package: 780‑FBGA (29×29) provides a space-efficient footprint for high-density board designs.
  • Single core supply: A clearly specified 1.15 V core rail simplifies power delivery design for the FPGA core.
  • Commercial temperature rating: Rated 0 °C to 85 °C to match a wide range of standard electronic product environments.

Why Choose EP4CE30F29C6?

The EP4CE30F29C6 positions itself as a well-documented Cyclone® IV E FPGA option for designers needing a balance of logic capacity, embedded memory, and a high I/O count in a compact surface-mount BGA package. Its defined electrical and thermal parameters support predictable integration into commercial-grade designs.

This part is suited to teams and projects that require on-chip logic and memory density with abundant I/O, packaged for medium- to high-density PCB layouts, backed by device handbook and datasheet level documentation for system-level design and verification.

Request a quote or submit a quotation request to receive pricing and availability for the EP4CE30F29C6. Our team can provide ordering details, lead times, and packaging options.

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