EP4CE30F29C6N

The EP4CE30F29C6N is a Cyclone IV E field programmable gate array from Intel designed for medium-density programmable logic applications. It delivers a balance of logic capacity, on-chip memory, and I/O connectivity in a compact BGA package suitable for surface-mount assembly.

Key device characteristics include 28,848 logic elements, approximately 0.61 Mbits of embedded memory (608,256 total RAM bits), 532 user I/O pins, and a 780-ball FBGA package (29×29). The device operates from a 1.15 V to 1.25 V core supply and is specified for commercial temperature operation (0 °C to 85 °C).

Key Features

• Core Architecture Cyclone IV E FPGA family—documented in the Cyclone IV Device Handbook and device datasheet for detailed electrical and timing specifications.
• Logic Resources 28,848 logic elements to implement combinational and sequential logic functions.
• Embedded Memory Approximately 0.61 Mbits of on-chip RAM (608,256 total RAM bits) for data buffering, FIFOs, and small memory structures.
• I/O Density 532 user I/O pins to support a broad range of peripheral and subsystem connections.
• Power Core voltage range of 1.15 V to 1.25 V to match system power domains.
• Package & Mounting 780-ball FBGA (780-BGA, 29×29) in a surface-mount package for high pin count in a compact footprint.
• Temperature & Grade Commercial grade operation with an ambient range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.
• Comprehensive Documentation Full device handbook and datasheet coverage (operating conditions, DC characteristics, power consumption, switching characteristics, transceiver and core performance specifications) are available for design and verification.

Unique Advantages

• Significant logic capacity: 28,848 logic elements enable implementation of complex state machines and custom logic functions without immediate need for external programmable devices.
• On-chip memory reduces external parts: Approximately 0.61 Mbits of embedded RAM supports data buffering and local storage, simplifying board-level memory requirements.
• High I/O count for integration: 532 I/O pins provide flexible connectivity for interfacing with sensors, peripherals, and high-pin-count subsystems.
• Compact, high-density package: The 780-FBGA (29×29) surface-mount package delivers high pin density while minimizing PCB area.
• Commercial temperature rating: 0 °C to 85 °C specification aligns with a wide range of commercial and industrial-adjacent applications.
• Standards-ready documentation: Detailed datasheet and Cyclone IV device handbook content help accelerate design, verification, and production readiness.

Why Choose EP4CE30F29C6N?

The EP4CE30F29C6N positions itself as a balanced mid-density Cyclone IV E FPGA choice for designs that require substantial logic resources, on-chip memory, and a high number of I/Os in a compact BGA package. Its electrical and functional specifications are documented in the Cyclone IV device handbook and datasheet to support system-level integration and verification.

This part is well suited for engineering teams and procurement seeking a RoHS-compliant, commercial-grade FPGA with defined operating voltage and temperature ranges, and with the documentation necessary to support development and production cycles.

If you would like pricing, availability, or to request a formal quote for EP4CE30F29C6N, please submit a procurement inquiry or request a quote from your preferred distributor or supplier channel.