EP4CE30F23I8L

The EP4CE30F23I8L is an Intel Cyclone IV E field-programmable gate array provided in a 484-ball BGA package. It delivers 28,848 logic elements and approximately 0.61 Mbits of embedded memory with 328 user I/Os, targeting designs that require significant logic capacity and a high I/O count in a surface-mount form factor.

Built for industrial environments, this device is specified for a supply range of 0.97 V to 1.03 V and an operating temperature range of −40 °C to 100 °C. Detailed device characteristics—including operating conditions, DC and switching specifications—are covered in the Cyclone IV device documentation.

Key Features

• Logic Capacity  28,848 logic elements provide substantial programmable logic resources for mid-density FPGA designs.
• Logic Block Count  Device architecture includes 1,803 CLBs to organize and implement user logic efficiently.
• Embedded Memory  Approximately 0.61 Mbits of on-chip RAM (608,256 bits) for buffers, FIFOs, and local data storage.
• I/O Resources  328 I/O pins support broad connectivity for interfaces, peripherals, and external devices.
• Power and Supply  Core supply specified from 0.97 V to 1.03 V, enabling controlled core-power design and predictable power budgeting.
• Package & Mounting  484-FBGA (23×23) surface-mount package (484-BGA case) for compact board-level integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control Systems  Use where industrial temperature range and a high I/O count are required to interface sensors, actuators, and control logic.
• Communications and Networking  Suitable for mid-density packet processing, protocol bridging, and I/O aggregation tasks that benefit from sizable logic and embedded RAM.
• Instrumentation and Test Equipment  Provides the logic density and on-chip memory useful for signal processing, data buffering, and custom measurement control.

Unique Advantages

• Significant Logic Resource: 28,848 logic elements enable implementation of complex custom logic while keeping the design on a single FPGA.
• Integrated Memory: Approximately 0.61 Mbits of embedded RAM reduces the need for external memory for small to moderate buffering and state storage.
• High I/O Count: 328 user I/Os offer flexible parallel connectivity options for peripherals and external interfaces.
• Industrial Reliability: Specified operating range of −40 °C to 100 °C and RoHS compliance support deployment in industrial environments.
• Compact BGA Packaging: 484-FBGA (23×23) surface-mount package enables dense PCB layouts for space-constrained designs.
• Documented Performance: Comprehensive device documentation covers operating conditions, DC characteristics, and switching specifications to support design validation.

Why Choose EP4CE30F23I8L?

The EP4CE30F23I8L combines sizable logic density, embedded memory, and a high I/O complement in an industrial-grade, surface-mount package, making it well suited to mid-density FPGA applications that require reliable operation across broad temperature ranges. Its documented device specifications and package options support repeatable design integration for engineering and procurement teams.

This device is a practical choice for customers developing industrial control, communications, and instrumentation equipment that demand a balanced mix of programmable logic, embedded RAM, and extensive I/O in a compact BGA footprint.

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