EP4CE30F23I7

The EP4CE30F23I7 is a Cyclone IV E Field Programmable Gate Array (FPGA) IC offering 28,848 logic elements and approximately 0.608 Mbits of embedded RAM. It provides up to 328 user I/Os in a 484-BGA (484-FBGA, 23×23) surface-mount package and is specified as industrial grade.

With a core voltage supply range of 1.15 V to 1.25 V and an operating temperature range of −40 °C to 100 °C, the device is suited for designs that require moderate logic density, significant I/O count, and industrial-temperature operation. Detailed device-level specifications are provided in the Cyclone IV device handbook and related datasheet documentation.

Key Features

• Logic Capacity  Approximately 28,848 logic elements to implement custom digital functions and control logic.
• Embedded Memory  Approximately 0.608 Mbits of on-chip RAM suitable for buffering, FIFOs, and small data structures.
• I/O Density  328 user I/Os to support multiple external interfaces and high pin-count systems.
• Package & Mounting  484-BGA package (supplier package: 484-FBGA, 23×23) in a surface-mount form factor for compact PCB implementations.
• Power  Core supply voltage range of 1.15 V to 1.25 V for integration with systemic power rails.
• Operating Range & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Embedded Control  Designed for systems that require industrial temperature operation and abundant I/O for sensor and actuator interfacing.
• Custom Logic and Protocol Bridging  Logic capacity and on-chip RAM allow implementation of glue logic, protocol translation, and control functions without excessive external components.
• High-Density I/O Gateways  High I/O count and compact FBGA package suit designs that need many external connections in a small PCB footprint.

Unique Advantages

• Balanced logic and memory combination  Delivers substantial logic resources alongside on-chip RAM to consolidate digital functions and reduce external memory needs.
• High I/O count  328 I/Os simplify system integration and reduce the need for additional I/O expansion chips.
• Industrial temperature capability  Specified −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
• Compact surface-mount package  484-FBGA (23×23) provides a high-pin-count, space-efficient package for dense PCB layouts.
• RoHS compliant  Meets lead-free assembly and environmental requirements.

Why Choose EP4CE30F23I7?

The EP4CE30F23I7 positions itself as a practical Cyclone IV E FPGA option for designs that need a balance of logic capacity, embedded memory, and high I/O density in an industrial-grade package. Its 28,848 logic elements, ~0.608 Mbits of on-chip RAM, and 328 I/Os enable consolidation of custom digital functions and interface logic while minimizing external BOM.

This device is well suited to engineers and product teams building industrial embedded systems, I/O-dense gateways, or custom logic modules that require a compact 484-FBGA surface-mount package, RoHS compliance, and operation across −40 °C to 100 °C.

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