EP4CE30F23C8N

The EP4CE30F23C8N is a Cyclone® IV E field programmable gate array (FPGA) manufactured by Intel. It provides a tightly integrated combination of programmable logic, embedded memory, and a high-density I/O complement in a compact 484-FBGA package.

Targeted at commercial applications, this device is suitable for designs that require approximately 28,848 logic elements, roughly 0.61 Mbits of embedded memory, and up to 328 I/O pins while operating from a 1.15 V–1.25 V core supply at standard commercial temperatures.

Key Features

• Programmable Logic Approximately 28,848 logic elements for implementing custom digital functions and logic-intensive tasks.
• Embedded Memory Approximately 0.61 Mbits of on-chip RAM (608,256 total bits) to support buffering, state storage, and local data processing.
• I/O Density 328 available I/O pins to support multiple external interfaces and high-pin-count connectivity requirements.
• Core Voltage Operates from a 1.15 V to 1.25 V core supply range for compatibility with standard FPGA power architectures.
• Package and Mounting 484-FBGA (23×23) package, surface-mount mounting type, delivering a compact footprint for space-constrained PCBs.
• Commercial Temperature Grade Rated for 0 °C to 85 °C operation to suit commercial-grade embedded systems.
• Standards and Documentation RoHS-compliant device with comprehensive documentation in the Cyclone IV Device Handbook covering operating conditions, DC characteristics, switching characteristics, power consumption, I/O standard specifications, ESD performance, and more.

Typical Applications

• Interface Bridging and I/O Expansion — Use the 328 I/O pins to implement protocol translators, bus bridges, or to add parallel and serial interfaces to a system.
• Custom Digital Logic — Implement bespoke datapath, control logic, and glue-logic using approximately 28,848 logic elements for mid-density digital designs.
• On-chip Buffering and Memory Tasks — Leverage approximately 0.61 Mbits of embedded RAM for FIFOs, small lookup tables, and local data storage to reduce external memory dependence.

Unique Advantages

• Balanced Logic and Memory Capacity: Approximately 28,848 logic elements paired with about 0.61 Mbits of embedded RAM supports a wide range of mid-density designs without immediate external memory needs.
• High I/O Count: 328 I/O pins provide flexibility for multiple interfaces and signal routing, simplifying board-level design for complex connectivity.
• Compact, Industry-Standard Package: 484-FBGA (23×23) delivers a small footprint for space-constrained applications while preserving signal density.
• Commercial Temperature Range: Rated for 0 °C to 85 °C, appropriate for standard commercial embedded systems and controlled environments.
• Low-Voltage Core: The 1.15 V–1.25 V supply range aligns with common FPGA power architectures for efficient system integration.
• Regulatory and Documentation Support: RoHS compliance and detailed device documentation (Cyclone IV Device Handbook) help streamline qualification and design verification.

Why Choose EP4CE30F23C8N?

The EP4CE30F23C8N positions itself as a versatile mid-density Cyclone® IV E FPGA option, combining a substantial logic fabric, measurable on-chip RAM, and a high I/O count in a compact 484-FBGA package. Its commercial temperature rating and RoHS compliance make it suitable for a broad set of commercial embedded designs that require programmable logic with integrated memory and ample connectivity.

Engineers and procurement teams looking for a documented, standards-backed FPGA solution will find this device well-suited for projects that demand a balance of logic capacity, embedded RAM, and I/O density while operating within common commercial voltage and temperature envelopes.

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