EP4CE30F23C8L
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 328 608256 28848 484-BGA |
|---|---|
| Quantity | 1,699 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 328 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1803 | Number of Logic Elements/Cells | 28848 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 608256 |
Overview of EP4CE30F23C8L – Cyclone® IV Field Programmable Gate Array (FPGA), 484-BGA
The EP4CE30F23C8L is a commercial-grade Cyclone® IV family FPGA from Intel, delivered in a 484-ball BGA (23×23) package. It provides a mid-range programmable logic platform with 28,848 logic elements and approximately 0.61 Mbits of embedded memory for custom digital functions and system integration.
With 328 user I/Os, a 0.97–1.03 V core supply range, and an operating temperature range of 0 °C to 85 °C, this device is suited for commercial embedded designs requiring a balance of logic capacity, memory, and I/O density. Detailed device specifications and electrical characteristics are documented in the Cyclone IV device handbook included with the product datasheet.
Key Features
- Logic Resources — 28,848 logic elements to implement mid-range combinational and sequential logic functions.
- Embedded Memory — 608,256 bits of on-chip RAM (approximately 0.61 Mbits) for buffering, FIFOs, and small lookup tables.
- I/O Capacity — 328 user I/O pins to interface with peripherals, sensors, and external devices.
- Package & Mounting — 484-ball FBGA (23×23) in a surface-mount package for compact board-level integration.
- Power & Voltage — Core supply range of 0.97 V to 1.03 V to match system power budgeting and regulator selection.
- Thermal & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
- Regulatory — RoHS compliant, meeting common environmental and manufacturing material requirements.
- Comprehensive Documentation — Datasheet and Cyclone IV device handbook coverage includes operating conditions, absolute maximum ratings, recommended operating conditions, DC characteristics, I/O specifications, power consumption, and switching characteristics.
Typical Applications
- Embedded System Control — Use the device’s logic capacity and on-chip RAM for custom control logic, finite-state machines, and peripheral management in commercial embedded products.
- Interface Bridging — Leverage 328 I/Os to implement protocol translation, bus bridging, and parallel/serial interface logic between multiple subsystems.
- Prototyping and Development — Deploy as a platform for validating custom digital designs that require significant logic resources and flexible I/O mapping in a compact BGA package.
Unique Advantages
- Substantial Logic Capacity: 28,848 logic elements provide the headroom for complex glue logic, custom accelerators, and moderate-density digital functions without external CPLDs.
- Integrated On-Chip Memory: Approximately 0.61 Mbits of embedded RAM reduces dependency on external memory for small buffers and lookup tables, simplifying PCB design.
- High I/O Count: 328 user I/Os enable connectivity to multiple peripherals and interfaces directly from the FPGA fabric.
- Compact BGA Packaging: 484-ball FBGA (23×23) supports high-density PCB layouts while maintaining robust mounting for commercial assemblies.
- Clear Electrical Envelope: Documented core voltage range (0.97–1.03 V) and comprehensive datasheet sections help accelerate power supply and thermal design decisions.
- RoHS Compliance: Meets material restrictions common to modern electronics manufacturing processes.
Why Choose EP4CE30F23C8L?
The EP4CE30F23C8L combines a substantial logic element count, embedded memory, and a large I/O complement in a surface-mount 484-BGA package, making it an effective choice for commercial-grade embedded designs that require programmable logic, interface flexibility, and compact board-level integration. Its documented electrical and thermal parameters support reliable integration into systems with defined power and temperature constraints.
This Cyclone IV device is appropriate for engineering teams seeking a mid-range FPGA solution with thorough datasheet guidance for operating conditions, I/O standards, power consumption, and switching characteristics.
Request a quote or submit an inquiry to evaluate EP4CE30F23C8L for your next design and to obtain pricing and availability details.

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