EP4CE30F23C6N

The EP4CE30F23C6N is an Intel Cyclone® IV field programmable gate array (FPGA) supplied in a 484‑ball BGA package. It provides a programmable logic fabric with 28,848 logic elements, on‑chip embedded memory, and a broad I/O count in a compact surface‑mount package for commercial‑grade designs.

Specified for a 1.15 V to 1.25 V core supply and an operating temperature range of 0 °C to 85 °C, this device is intended for commercial applications that require flexible, reprogrammable digital logic with significant I/O and embedded memory resources.

Key Features

• Logic Capacity  Approximately 28,848 logic elements enable implementation of complex custom digital logic and state machines.
• Embedded Memory  Approximately 0.608 Mbits of total on‑chip RAM to support buffers, FIFOs, and local storage for user logic.
• I/O Resources  328 user I/O pins provide connectivity for interfaces, peripherals, and external devices.
• Package & Mounting  484‑ball BGA (484‑FBGA, 23×23) in a surface‑mount configuration for a compact board footprint and high‑density routing.
• Power Supply  Core voltage range is 1.15 V to 1.25 V, allowing designers to plan power delivery and sequencing accordingly.
• Operating Conditions & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C, and RoHS compliance for environmental conformity.
• Manufacturer & Family  Part of the Cyclone IV device family from Intel (formerly Altera), documented in the Cyclone IV Device Handbook for device‑level specifications.

Typical Applications

• Commercial embedded systems  Use the device’s 28,848 logic elements and 328 I/Os to implement custom control, interface bridging, and protocol logic in commercial products.
• Custom digital processing  Deploy on‑chip RAM and logic resources to build application‑specific datapaths, buffering, and control logic.
• Prototype and development platforms  Leverage reprogrammability and a high I/O count for rapid development and iteration of digital designs in a commercial temperature range.

Unique Advantages

• Substantial logic density: Approximately 28,848 logic elements provide the capacity to integrate multiple functions and subsystems into a single device.
• On‑chip memory resources: Approximately 0.608 Mbits of embedded RAM reduce reliance on external memory for many buffering and temporary storage needs.
• High I/O count: 328 I/O pins support diverse peripheral connections and parallel interfaces without immediate need for external I/O expanders.
• Compact BGA package: 484‑FBGA (23×23) balances pin density and board area for space‑constrained commercial designs.
• Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS‑compliant for standard commercial deployments and regulatory alignment.
• Documented architecture: Backed by Cyclone IV device documentation (Cyclone IV Device Handbook) for detailed electrical and timing specifications.

Why Choose EP4CE30F23C6N?

The EP4CE30F23C6N combines a sizeable logic fabric, on‑chip memory, and a high I/O count in a compact 484‑ball BGA footprint, making it well suited for commercial designs that require programmable logic and extensive interfacing. Its specified core voltage range and commercial temperature rating help teams plan power and thermal design with clear, verifiable constraints.

Choose this Cyclone IV device when you need a reprogrammable, documented FPGA solution from Intel with clear electrical and packaging specifications for commercial product development and prototyping.

If you would like pricing, lead‑time information, or to request a formal quote for EP4CE30F23C6N, please submit an inquiry indicating required quantities and delivery preferences.