EP4CE30F23A7N

The EP4CE30F23A7N is a Cyclone® IV E field programmable gate array delivering configurable logic capacity, on-chip memory and substantial I/O in a compact BGA package. It targets applications that require up to 28,848 logic elements, approximately 0.61 Mbits of embedded memory and up to 328 I/O pins, all in a 484-FBGA (23×23) footprint.

Designed with a 1.15 V to 1.25 V core supply range and an operating temperature window from −40 °C to 125 °C, this device includes AEC‑Q100 qualification and automotive grading for use in temperature- and reliability-sensitive embedded applications.

Key Features

• Core Logic Provides 28,848 logic elements to implement custom digital logic, control functions and programmable datapaths.
• Embedded Memory Approximately 0.61 Mbits of on-chip RAM to support buffers, FIFOs and local storage for high-speed logic functions.
• I/O Density Up to 328 I/O pins to interface with sensors, actuators, peripherals and high-density connector systems.
• Package 484-FBGA (23×23) package provides a compact, high-pin-count surface-mount solution for space-constrained boards.
• Power Core voltage supply range of 1.15 V to 1.25 V to match platform power architectures and design requirements.
• Automotive Qualification & Temperature Range AEC‑Q100 qualification with a −40 °C to 125 °C operating range supports deployment in automotive and other temperature-demanding environments.
• Mounting & Compliance Surface-mount device construction and RoHS compliance for modern manufacturing processes and environmental standards.

Typical Applications

• Automotive Electronic Systems Suitable for in-vehicle control and signal processing functions where AEC‑Q100 qualification and wide temperature range are required.
• Embedded Control and Signal Processing Implement custom processing, protocol bridging or control logic using the device’s logic and embedded RAM resources.
• High-Density I/O Aggregation Aggregate and route multiple sensor, actuator or peripheral interfaces using the available 328 I/O pins in a compact package.

Unique Advantages

• High Logic Capacity: 28,848 logic elements enable implementation of complex state machines, datapaths and control logic on a single device.
• On-Chip Memory: Approximately 0.61 Mbits of embedded RAM reduces the need for external memory in many buffering and storage tasks.
• Automotive-Grade Qualification: AEC‑Q100 qualification and a −40 °C to 125 °C operating range support demanding environmental requirements.
• Compact, High-Pin Package: 484-FBGA (23×23) delivers high I/O density in a compact, surface-mount form factor for space-efficient board designs.
• Narrow Core Supply Range: 1.15 V to 1.25 V core supply accommodates platform power architectures and helps ensure predictable power integration.
• RoHS-Compliant: Meets RoHS requirements for environmentally conscious manufacturing and deployment.

Why Choose EP4CE30F23A7N?

The EP4CE30F23A7N positions itself as a balanced solution for designers who need a combination of substantial logic resources, embedded memory and high I/O count within an automotive-qualified package. Its operating voltage range, wide temperature capability and RoHS compliance make it suitable for robust embedded and in-vehicle deployments.

This device is well suited to customers building control, interfacing and signal-processing designs that require on-chip logic and memory capacity along with a compact 484-FBGA footprint. The combination of automotive qualification and the specified electrical and mechanical characteristics supports long-term use in temperature- and reliability-sensitive applications.

Request a quote or submit an inquiry to receive pricing and availability for the EP4CE30F23A7N. Our team can provide delivery lead times and support for procurement and integration planning.