EP4CE30F23C7

The EP4CE30F23C7 is a Cyclone® IV field‑programmable gate array (FPGA) supplied in a 484‑ball fine‑pitch BGA package. It delivers a mid‑range logic capacity and integrated on‑chip memory for programmable digital designs targeted at commercial applications.

With a core voltage range of 1.15 V to 1.25 V, 328 general‑purpose I/Os, and an ambient operating range of 0 °C to 85 °C, this device is intended for commercial embedded systems requiring flexible, reconfigurable logic and moderate I/O density.

Key Features

• Logic Capacity — 28,848 logic elements for implementing custom combinational and sequential logic.
• Embedded Memory — Approximately 0.61 Mbits of on‑chip RAM (608,256 total bits) to support buffering, LUTs, and small data stores.
• I/O Density — 328 I/O pins to support multiple interfaces and parallel signal paths in a single device.
• Core Voltage — Operates from 1.15 V to 1.25 V, matching common low‑voltage FPGA power rails.
• Package & Mounting — 484‑FBGA (23×23) package in a surface‑mount form factor for compact, high‑density PCB layouts.
• Commercial Grade Temperature — Rated for 0 °C to 85 °C ambient operation for typical commercial environments.
• Standards Compliance — RoHS compliant for environmental and lead‑free assembly requirements.

Typical Applications

• Embedded Systems — Use as the programmable logic heart of commercial embedded controllers where moderate logic and memory resources are required.
• Interface Bridging — Ideal for consolidating multiple parallel or serial interfaces using its 328 I/Os to simplify board-level integration.
• Prototyping and Development — Offers reconfigurable logic capacity suitable for proof‑of‑concept designs and iterative hardware development.
• Consumer and Commercial Electronics — Fits designs that require a balance of logic elements, on‑chip RAM, and compact BGA packaging for space‑constrained PCBs.

Unique Advantages

• Substantial logic resources: 28,848 logic elements provide room for complex custom logic and state machines without external ASIC development.
• Integrated memory: Approximately 0.61 Mbits of embedded RAM reduces dependence on external memory for many buffering and data‑path tasks.
• High I/O count: 328 I/Os allow direct connection to multiple peripherals and high‑pin-count interfaces, minimizing external glue logic.
• Compact, manufacturable package: 484‑FBGA (23×23) surface‑mount package supports high‑density PCB layouts and automated assembly processes.
• Low‑voltage core: 1.15 V–1.25 V supply range aligns with modern, power‑efficient FPGA power architectures.
• Commercial temperature rating and RoHS compliance: Suitable for standard commercial environments and lead‑free production requirements.

Why Choose EP4CE30F23C7?

The EP4CE30F23C7 positions itself as a flexible, mid‑range Cyclone IV FPGA option for commercial designs that need a balance of logic capacity, on‑chip memory, and a high I/O count in a compact BGA package. It is well suited to engineers building embedded systems, interface controllers, or prototyping platforms where reconfigurability and board‑level integration are priorities.

Its combination of 28,848 logic elements, approximately 0.61 Mbits of embedded memory, and 328 I/Os enables consolidated designs that reduce external components and simplify BOMs, while the 484‑FBGA package and RoHS compliance support modern manufacturing and assembly flows.

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