EP4CE30F23C8LN
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 328 608256 28848 484-BGA |
|---|---|
| Quantity | 231 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 328 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1803 | Number of Logic Elements/Cells | 28848 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 608256 |
Overview of EP4CE30F23C8LN – Cyclone® IV E FPGA, 484-BGA
The EP4CE30F23C8LN is a Cyclone® IV E field-programmable gate array (FPGA) in a 484-ball BGA package designed for commercial-grade programmable logic applications. It integrates reconfigurable logic, on-chip memory, and a high-density I/O count to support a range of digital designs that require flexible hardware implementation.
With 28,848 logic elements and approximately 0.61 Mbits of embedded memory, the device balances logic capacity and on-chip RAM while exposing 328 I/O pins and a compact 484-FBGA (23×23) footprint for system integration.
Key Features
- Core Logic — 28,848 logic elements for implementing custom digital circuits and state machines.
- Logic Array Blocks — 1,803 logic array blocks as reported in device topology to organize and structure logic resources.
- Embedded Memory — Approximately 0.61 Mbits of on-chip RAM (608,256 total RAM bits) for buffering, FIFOs, and small lookup tables.
- I/O Capacity — 328 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
- Package & Mounting — 484-FBGA (23×23) surface-mount package (484-BGA case) for high-density board designs and compact system layouts.
- Power Supply — Core voltage supply range of 0.970 V to 1.03 V, enabling defined power provisioning for the device core.
- Operating Conditions — Commercial-grade temperature range from 0 °C to 85 °C to match standard commercial deployments.
- RoHS Compliant — Conforms to RoHS requirements for lead-free assembly and regulatory compliance.
- Comprehensive Documentation — Device handbook and datasheet detail operating conditions, DC characteristics, power consumption, and switching specifications for design and qualification.
Typical Applications
- Configurable Logic and Glue Logic — Implement custom protocol adapters, bus bridges, and glue logic between system components that require reconfigurable hardware.
- Control and Signal Processing — Deploy digital control algorithms and moderate-complexity signal-processing blocks using on-chip logic and memory.
- Prototyping and Development — Use as a platform for hardware prototyping where reprogrammability and rapid iterations are needed.
Unique Advantages
- Balanced Logic and Memory: 28,848 logic elements paired with 608,256 bits of RAM provide a middle-ground resource mix for many commercial FPGA designs.
- High I/O Density: 328 I/O pins enable broad external connectivity without requiring larger packages.
- Compact BGA Package: The 484-FBGA (23×23) package offers a space-efficient solution for board-level integration in constrained layouts.
- Defined Power Envelope: A tightly specified core supply range (0.970–1.03 V) simplifies power-supply planning and thermal considerations.
- Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to meet standard commercial deployment requirements.
- Standards-Conscious Compliance: RoHS compliance supports lead-free assembly requirements in modern electronics production.
Why Choose EP4CE30F23C8LN?
The EP4CE30F23C8LN positions itself as a commercially graded Cyclone IV E FPGA offering a pragmatic combination of logic density, embedded memory, and generous I/O in a 484-BGA package. Its specification set supports designers who need reconfigurable hardware for control, interfacing, and moderate-complexity processing while keeping board space and BOM complexity under control.
Supported by detailed device documentation that covers operating conditions, DC characteristics, power consumption, and switching behavior, the EP4CE30F23C8LN is suitable for teams requiring verifiable specifications and predictable integration into commercial electronic systems.
Request a quote or submit a procurement inquiry for the EP4CE30F23C8LN to receive pricing and availability information tailored to your project requirements.

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