EP4CE30F23C7N

The EP4CE30F23C7N is a Cyclone® IV E Field Programmable Gate Array (FPGA) manufactured by Intel. It is a commercial‑grade, surface‑mount FPGA offering a large logic resource set and on‑chip memory suitable for configurable digital designs.

Designed for commercial applications with moderate thermal and supply requirements, the device combines 28,848 logic elements, approximately 0.61 Mbits of embedded memory, and 328 general‑purpose I/O pins in a 484‑BGA (484‑FBGA, 23×23) package. Detailed device operating and electrical characteristics are documented in the Cyclone IV Device Handbook, Volume 3.

Key Features

• Core Logic  28,848 logic elements (LEs) provide the programmable fabric for custom digital logic implementations and complex combinational/sequential designs.
• Embedded Memory  Approximately 0.61 Mbits of on‑chip RAM for buffering, FIFOs, and small data storage without external memory.
• I/O and Package  328 I/O pins support broad external interfacing requirements. Device is supplied in a 484‑BGA (484‑FBGA, 23×23) surface‑mount package.
• Power Supply  Core supply voltage range: 1.15 V to 1.25 V, enabling predictable core power and voltage planning in system design.
• Temperature and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C, appropriate for commercial and controlled‑environment deployments.
• Compliance and Documentation  RoHS‑compliant. Detailed device specifications—operating conditions, DC characteristics, switching characteristics, and power consumption—are available in the Cyclone IV Device Handbook, Volume 3.

Typical Applications

• Commercial Embedded Systems  Use the device to implement custom control logic, protocol handling, or data‑path acceleration within commercial equipment.
• Prototyping and Development  Large logic capacity and flexible I/O make the FPGA suitable for proof‑of‑concept designs and hardware validation prior to production.
• Interface and Glue Logic  High I/O count supports complex board‑level interfacing, signal routing, and protocol bridging between components.
• Signal Buffering and Small‑Scale Memory  On‑chip RAM provides embedded storage for FIFOs, line buffers, or small data caches without immediate need for external memory.

Unique Advantages

• Substantial Logic Capacity:  28,848 logic elements enable implementation of sizeable custom logic blocks and moderate system integration onto a single device.
• Integrated On‑Chip Memory:  Approximately 0.61 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage, simplifying BOM and board layout.
• High I/O Density:  328 I/O pins in a 484‑BGA package provide flexible connectivity for multi‑interface systems and complex peripheral routing.
• Commercial Temperature Rating:  Rated for 0 °C to 85 °C operation, matching requirements for many consumer and commercial electronics applications.
• Predictable Power Domain:  Core voltage specification (1.15 V–1.25 V) supports consistent power design and integration into multi‑rail systems.
• Standards‑Compliant Manufacturing:  RoHS compliance supports environmentally responsible manufacturing and supply chain requirements.

Why Choose EP4CE30F23C7N?

EP4CE30F23C7N positions itself as a versatile commercial‑grade FPGA option within the Cyclone IV E family, delivering substantial programmable logic and on‑chip memory in a compact 484‑BGA package. Its combination of 28,848 logic elements, approximately 0.61 Mbits of embedded RAM, and 328 I/O pins makes it suitable for designs that require moderate integration of custom logic, buffering, and flexible interfacing.

Engineers selecting this device benefit from clear electrical and operating guidelines provided in the Cyclone IV Device Handbook (Volume 3) and a RoHS‑compliant BOM footprint—helping teams streamline design decisions for commercial products and prototypes.

Request a quote or submit a purchase inquiry for EP4CE30F23C7N to begin integrating this Cyclone IV E FPGA into your next commercial design.