EP4CE30F19A7N

The EP4CE30F19A7N is an Intel Cyclone® IV E Field Programmable Gate Array (FPGA) delivered in a 324-ball BGA package. It provides a balance of programmable logic capacity, on-chip memory, and a substantial I/O count for applications that require reconfigurable logic in a compact package.

With 28,848 logic elements, approximately 0.61 Mbits of embedded memory, and 193 I/O, this automotive-grade device is positioned for designs that demand programmable resources, robust operating range, and AEC-Q100 qualification.

Key Features

• Core Logic — 28,848 logic elements provide sizable programmable logic capacity for implementing custom digital functions and control logic.
• Embedded Memory — Approximately 0.61 Mbits (608,256 bits) of on-chip RAM to support buffers, FIFOs, and temporary storage directly within the FPGA fabric.
• I/O Density — 193 I/O pins enable broad interfacing options for peripherals, sensors, and external devices while consolidating board-level routing.
• Power — Core voltage supply range from 1.15 V to 1.25 V to match expected Cyclone IV E core requirements.
• Package & Mounting — 324-ball FBGA (19 × 19) surface-mount package that supports high-density board integration in a compact footprint.
• Temperature & Qualification — Automotive grade with AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for extended-environment reliability.
• Environmental Compliance — RoHS compliant to meet standard environmental requirements.

Typical Applications

• Automotive Electronics — AEC-Q100 qualification and wide operating temperature make this FPGA suitable for automotive control, monitoring, and interface tasks where reprogrammability is required.
• Embedded Control — Use the programmable logic and on-chip memory to implement custom control algorithms, glue logic, and timing-critical functions.
• I/O Aggregation and Bridging — High I/O count supports consolidation of multiple interfaces and protocol bridging on a single device.

Unique Advantages

• Substantial Logic Capacity: 28,848 logic elements enable complex designs and feature integration that reduce the need for multiple discrete devices.
• On-Chip Memory: Approximately 0.61 Mbits of embedded RAM supports local buffering and data staging without external memory.
• High I/O Count: 193 I/O pins provide flexibility for dense connectivity and interface consolidation on space-constrained PCBs.
• Automotive-Grade Qualification: AEC-Q100 qualification and −40 °C to 125 °C operation support deployment in demanding automotive environments.
• Compact Packaging: 324-FBGA (19 × 19) surface-mount package enables high-density board designs while maintaining thermal and signal integrity characteristics suitable for the device class.
• Controlled Core Power: Narrow core voltage range (1.15 V to 1.25 V) aligns power delivery design to expected device requirements.

Why Choose EP4CE30F19A7N?

The EP4CE30F19A7N delivers a balanced combination of programmable logic resources, embedded memory, and a high I/O count in a compact 324-BGA footprint. Its AEC-Q100 qualification and extended operating temperature range position it for automotive and other demanding environments where reliability and reconfigurability are required.

This device is suited for engineering teams seeking a single-chip programmable solution that consolidates functions, reduces BOM complexity, and supports designs requiring moderate on-chip RAM and extensive I/O. Backed by Intel as the manufacturer, the part offers a clear path for integration into production systems that demand automotive-grade qualification and compact packaging.

Request a quote or contact sales to discuss availability, pricing, and how EP4CE30F19A7N can meet your design requirements.