EP4CE22F17I8LN

The EP4CE22F17I8LN is a Cyclone® IV E field-programmable gate array (FPGA) IC from Intel, provided in a 256-LBGA surface-mount package. It delivers a balance of programmable logic, embedded memory, and flexible I/O in an industrial-grade device suitable for temperature-sensitive designs.

Key on-chip resources include 22,320 logic elements and approximately 0.61 Mbits of embedded memory, complemented by 153 user I/O pins. The device operates from a core supply range of 0.970 V to 1.03 V and supports an operating temperature range of −40 °C to 100 °C. The device is RoHS compliant.

Key Features

• Core and Logic  22,320 logic elements provide a substantial programmable fabric for implementing custom logic, state machines, and glue logic.
• On-Chip Memory  Approximately 0.61 Mbits of embedded RAM bits for buffering, LUT-based storage, and local data paths.
• I/O Capacity  153 available I/O pins to support parallel interfaces, peripheral connections, and board-level integration.
• Package and Mounting  256-LBGA (supplier device package: 256-FBGA, 17 × 17) in a surface-mount form factor for compact, high-density board designs.
• Power  Core voltage supply specified from 0.970 V to 1.03 V to match system power rails and support stable core operation.
• Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in thermally demanding environments.
• Environmental Compliance  RoHS compliant to meet environmental and manufacturing requirements.
• Documentation  Detailed Cyclone IV Device Handbook content is available for design, operating conditions, and electrical characteristics.

Typical Applications

• Custom programmable logic and prototyping  Use the device's 22,320 logic elements and embedded memory to implement proof-of-concept designs and application-specific logic blocks.
• Embedded control and system glue logic  Leverage the mix of logic and I/O to integrate control functions, peripheral interfaces, and data handling on a single FPGA.
• I/O-rich interface bridging  153 I/O pins enable board-level signal routing and interface bridging between subsystems with compact packaging.

Unique Advantages

• Industrial temperature capability: Rated from −40 °C to 100 °C to support designs exposed to wide operating conditions.
• High logic density in a compact package: 22,320 logic elements in a 256-LBGA package reduce board area while enabling complex logic implementation.
• Ample embedded memory: Approximately 0.61 Mbits of on-chip RAM supports local buffering and state storage without external memory.
• Generous I/O count: 153 user I/O pins provide flexibility for multiple interfaces and peripheral connections.
• Precise core power window: Defined supply range (0.970 V–1.03 V) helps ensure predictable core behavior and ease of power-supply design.
• Regulatory and manufacturing fit: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose EP4CE22F17I8LN?

The EP4CE22F17I8LN positions itself as a reliable industrial-grade Cyclone IV E FPGA option for engineers who need balanced programmable logic capacity, embedded memory, and a significant number of I/Os in a compact surface-mount package. Its defined power range and extended operating temperature make it suitable for designs that require predictable core operation and wide thermal tolerance.

This device is well suited to teams implementing custom logic, consolidating discrete functions onto a single FPGA, or developing prototypes that will scale into production. The combination of documented device characteristics and industry-standard packaging supports a streamlined design and qualification process.

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