EP4CE22F17I7

The EP4CE22F17I7 is an Intel Cyclone IV E field programmable gate array supplied in a 256-pin BGA package. It integrates 22,320 logic elements and approximately 0.608 Mbits of on-chip RAM with 153 user I/O pins in a compact surface-mount package.

Designed for industrial-grade embedded designs, the device operates from a 1.15 V to 1.25 V core supply and across an operating temperature range of −40 °C to 100 °C. Complete electrical and device-level specifications are documented in the Cyclone IV Device Handbook, Volume 3.

Key Features

• Logic Capacity — 22,320 logic elements provide programmable fabric for custom digital functions and system integration.
• Embedded Memory — 608,256 total RAM bits, offering approximately 0.608 Mbits of on-chip memory for buffering, state storage, and local data processing.
• I/O Resources — 153 user I/O pins to support a wide range of peripheral interfaces and board-level connections.
• Package and Mounting — Surface-mount 256-LBGA package; supplier device package listed as 256-FBGA (17×17) for compact board integration.
• Power — Core voltage supply range of 1.15 V to 1.25 V to match target power domains and system-level power design.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement custom control logic, state machines, and interface glue in factory automation and process control systems.
• Communications Infrastructure — Support protocol handling, packet processing, and interface bridging where flexible digital logic is required.
• Embedded Systems — Integrate application-specific accelerators, data buffering, and peripheral management for embedded products and appliances.
• Prototyping and Development — Use as a development platform for validating digital designs and migrating IP to production hardware.

Unique Advantages

• Balanced Logic and Memory: The combination of 22,320 logic elements and approximately 0.608 Mbits of embedded RAM supports complex logic and local data handling without immediate external memory.
• Generous I/O Count: With 153 I/Os, the device accommodates multiple interfaces and board-level connections, reducing the need for external multiplexing.
• Compact BGA Footprint: The 256-ball BGA (256-FBGA 17×17 / 256-LBGA) enables dense PCB layouts and space-efficient system designs.
• Industrial Temperature Rating: Specified operation from −40 °C to 100 °C allows deployment in temperature-challenging environments.
• Low-Voltage Core: A 1.15 V to 1.25 V supply range supports modern power architectures and helps manage system power budgets.
• Standards-Conscious: RoHS compliance supports regulatory and sustainability objectives in product design.

Why Choose EP4CE22F17I7?

The EP4CE22F17I7 delivers a practical mix of logic density, on-chip memory, and I/O capability in a compact industrial-grade BGA package. Its specification set is well-suited for engineers who need programmable logic to implement custom digital functions, interface consolidation, and on-board data handling within temperature-demanding applications.

Documentation and device-level parameters are available in the Cyclone IV Device Handbook, Volume 3, providing the detailed electrical and timing information required for integration, qualification, and production deployment.

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