EP4CE22F17C9LN

The EP4CE22F17C9LN is a Cyclone® IV E field programmable gate array (FPGA) from Intel, supplied in a 256‑lead BGA package. It provides a mid-range logic capacity and on‑chip memory with a comprehensive set of I/O for embedded and system designs.

Targeted at commercial applications, this device combines 22,320 logic elements, approximately 0.608 Mbits of embedded RAM, and 153 user I/Os in a compact 256‑lead package, enabling flexible integration for communication, control, and signal‑processing tasks.

Key Features

• Logic Capacity — 22,320 logic elements to implement moderate-complexity digital logic and state machines.
• Embedded Memory — Approximately 0.608 Mbits of on‑chip RAM for buffering, small FIFOs, and local data storage.
• I/O Resources — 153 user I/Os to support a variety of peripheral interfaces and multi‑signal connectivity.
• Package and Mounting — 256‑lead LBGA package; supplier device package listed as 256‑FBGA (17×17). Surface‑mount mounting type for standard PCB assembly.
• Power and Core Voltage — Core supply range from 970 mV to 1.03 V to match platform power rails and board power designs.
• Operating Temperature — Commercial temperature grade with specified operation from 0 °C to 85 °C.
• Regulatory — RoHS‑compliant product for environmental compliance in commercial electronics.

Typical Applications

• Communications Equipment — Implements protocol handlers, control logic, and moderate packet buffering using the device’s logic and on‑chip RAM.
• Embedded Control — Provides glue logic, I/O interfacing, and control state machines for consumer and commercial embedded systems.
• Signal Processing and Data Conditioning — Supports preprocessing, format conversion, and small buffering tasks where compact on‑chip memory and numerous I/Os are required.
• Prototyping and Evaluation — Suited for development platforms and evaluation boards that require a mid‑density FPGA in a compact BGA package.

Unique Advantages

• Substantial Logic Resource: 22,320 logic elements provide the headroom to implement complex finite state machines, custom logic blocks, and control functions without external gate arrays.
• Integrated On‑Chip Memory: Approximately 0.608 Mbits of embedded RAM reduces the need for small external memory devices for buffering and local data storage.
• High I/O Count in a Compact Package: 153 I/Os in a 256‑lead BGA footprint deliver flexible board routing and peripheral interfacing while keeping PCB area efficient.
• Commercial Temperature and RoHS Compliance: Specified 0 °C to 85 °C operation and RoHS compliance support reliable deployment across commercial product lines and manufacturing requirements.
• Low‑Voltage Core Operation: Core supply range of 970 mV to 1.03 V enables integration with modern low‑voltage power architectures.

Why Choose EP4CE22F17C9LN?

The EP4CE22F17C9LN positions itself as a compact, mid‑density FPGA option for commercial embedded and communications designs that require a balanced combination of logic, memory, and I/O in a small BGA package. Its 22,320 logic elements and approximately 0.608 Mbits of embedded RAM allow designers to consolidate glue logic, buffering, and control functions on a single device.

Engineers and procurement teams looking for a commercially graded Cyclone IV E device will find this part suitable for applications demanding moderate logic capacity, a substantial I/O count, and standard surface‑mount packaging, backed by Intel’s Cyclone IV product documentation.

Request a quote or submit a pricing inquiry to obtain availability and lead‑time information for EP4CE22F17C9LN.