EP4CE30F29C8N

The EP4CE30F29C8N is a Cyclone® IV E Field Programmable Gate Array (FPGA) offered by Intel. It provides a programmable logic fabric with 28,848 logic elements and embedded memory to implement custom digital functions.

With support for up to 532 I/O pins, a 780‑ball BGA package, and a nominal core supply range of 1.15 V to 1.25 V, this commercial‑grade device targets I/O‑dense and logic‑intensive embedded designs that require compact surface‑mount packaging and RoHS compliance.

Key Features

• Logic Capacity — 28,848 logic elements for implementing custom combinational and sequential logic.
• Embedded Memory — Approximately 0.61 Mbits (608,256 bits) of on‑chip RAM to support buffers, FIFOs and local data storage.
• I/O Density — Up to 532 I/O pins suitable for multi‑interface or parallel signaling applications.
• Power Supply — Core operating voltage 1.15 V to 1.25 V, enabling deterministic core supply design.
• Package and Mounting — 780‑BGA (780‑FBGA, 29×29) surface‑mount package for high‑density board integration.
• Operating Range — Commercial operating temperature range of 0 °C to 85 °C for typical commercial applications.
• Environmental Compliance — RoHS compliant to meet environmental regulatory requirements.
• Documentation — Device is supported by the Cyclone IV Device Handbook series for electrical, timing and layout guidance.

Typical Applications

• I/O‑intensive interface bridging — Use the high I/O count to implement multi‑bus interfaces, protocol conversion or peripheral aggregation on compact PCBs.
• Custom control and logic — Deploy the device’s 28,848 logic elements and embedded RAM for control logic, state machines and application‑specific datapaths.
• Embedded system integration — Ideal for commercial embedded designs requiring a surface‑mount FPGA in a 780‑BGA package with RoHS compliance.

Unique Advantages

• Substantial logic resources: 28,848 logic elements enable complex custom functionality without multiple discrete ICs.
• On‑chip memory: Approximately 0.61 Mbits of embedded RAM reduces external memory dependency for buffering and local storage.
• High pin count: 532 I/O pins support broad interfacing options and simplify system routing for multi‑signal designs.
• Compact BGA packaging: The 780‑FBGA (29×29) surface‑mount package delivers high density for space‑constrained boards.
• Commercial temperature and RoHS compliance: Suited for mainstream commercial products with environmental compliance considerations.

Why Choose EP4CE30F29C8N?

The EP4CE30F29C8N combines a substantial logic element count, meaningful on‑chip RAM and a high I/O count in a compact 780‑BGA package, making it a practical choice for commercial embedded designs that require programmable logic and dense interfacing. Its 1.15 V–1.25 V core supply range and 0 °C–85 °C operating range align with common commercial system power and thermal profiles.

Designers can leverage the Cyclone IV device documentation for detailed electrical and timing guidance, enabling reliable integration into boards where surface‑mount BGA packaging and RoHS compliance are required.

Request a quote or submit your inquiry to receive pricing and availability for the EP4CE30F29C8N and to discuss how it fits your next design.