EP4CE30F29I7N

The EP4CE30F29I7N is a Cyclone® IV E Field Programmable Gate Array (FPGA) device from Intel, supplied in a 780-ball FBGA package (29×29). This industrial-grade FPGA provides a programmable logic fabric with a large I/O count and embedded on-chip memory for implementing custom digital functions in demanding environments.

Designed for surface-mount assembly and RoHS-compliant, the device operates from a core voltage range of 1.15 V to 1.25 V and supports an operating temperature range of −40 °C to 100 °C, enabling deployment in industrial embedded systems that require robust thermal margins and high integration.

Key Features

• Programmable Logic Capacity  Provides 28,848 logic elements for implementing complex custom logic and state machines.
• Embedded Memory  Includes 608,256 bits of on-chip RAM (approximately 0.61 Mbits) to support buffering, look-up tables, and small memory structures without external RAM.
• High I/O Count  Features 532 I/O pins to consolidate multiple interfaces and connect to sensors, peripherals, and external devices.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation to meet industrial environmental requirements.
• Core Voltage Range  Operates from a 1.15 V to 1.25 V core supply, consistent with Cyclone IV E power domains.
• Package and Mounting  Supplied in a 780-ball FBGA (29×29) package case for surface-mount PCB assembly.
• RoHS Compliance  Manufactured to RoHS-compliant standards for environmental and regulatory requirements.

Typical Applications

• Industrial Control  Use the EP4CE30F29I7N to implement custom control logic, I/O aggregation, and protocol bridging in industrial automation equipment, leveraging its industrial temperature rating and high I/O count.
• Embedded Processing  Deploy as a flexible programmable fabric for glue logic, peripheral interfacing, and specialized datapath acceleration where moderate on-chip RAM and abundant logic elements are required.
• Communications and Interface  Consolidate multiple parallel and serial interfaces using the device’s 532 I/O pins to simplify board-level connectivity and reduce external components.

Unique Advantages

• Significant Logic Density: 28,848 logic elements enable implementation of sizable custom logic without immediate need for larger devices.
• On-Chip Memory: Approximately 0.61 Mbits of embedded RAM reduce dependence on external memory for buffering and small LUT-based storage.
• Large I/O Count: 532 I/Os allow consolidation of multiple interfaces and peripherals, reducing BOM complexity and board routing challenges.
• Industrial-Grade Operation: Rated for −40 °C to 100 °C, making the device suitable for industrial environments with broad temperature swings.
• Standard FBGA Packaging: The 780-ball FBGA (29×29) package supports high-density PCB implementations while remaining compatible with surface-mount manufacturing processes.
• Proven Device Family Documentation: The Cyclone IV device handbook and datasheet material provide detailed electrical, timing, and reliability guidance for design and qualification.

Why Choose EP4CE30F29I7N?

The EP4CE30F29I7N balances mid-range logic density, embedded memory, and a very high I/O count in a compact 780-FBGA package, targeting industrial applications that need programmable flexibility with robust thermal performance. Its specified core voltage range and RoHS compliance simplify power sequencing and regulatory planning for production designs.

Ideal for engineers and procurement teams designing industrial embedded systems, communications interfaces, or specialized control logic, the device offers a clear trade-off between integration and package density while being supported by Cyclone IV family documentation from the manufacturer.

Request a quote or submit an inquiry to receive pricing and availability for the EP4CE30F29I7N and discuss how this Cyclone IV E FPGA can be integrated into your next design.