EP4CE40F19A7N

IC FPGA 193 I/O 324FBGA
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 193 1161216 39600 324-BGA

Quantity 1,285 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case324-BGANumber of I/O193Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2475Number of Logic Elements/Cells39600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits1161216

Overview of EP4CE40F19A7N – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 193 1161216 39600 324-BGA

The EP4CE40F19A7N is an Intel Cyclone® IV E FPGA offering 39,600 logic elements in a compact 324-ball BGA package. Designed for applications that require mid-density programmable logic, it provides a balance of logic capacity, on-chip memory and I/O in an automotive-qualified device.

Key electrical and environmental characteristics include a nominal core supply range of 1.15–1.25 V, 193 available I/O pins, approximately 1.16 Mbits of embedded memory, and an operating temperature range of −40 °C to 125 °C consistent with its AEC-Q100 qualification.

Key Features

  • Core Logic  39,600 logic elements to implement custom digital logic, state machines and glue logic for mid-density designs.
  • Embedded Memory  Approximately 1.16 Mbits of on-chip RAM to support buffering, FIFOs and local data storage without external memory.
  • I/O Capacity  193 user I/O pins for flexible interfacing to peripherals, sensors and external devices.
  • Power  Operates from a core supply in the 1.15 V to 1.25 V range to match system power-rail planning.
  • Package and Mounting  324-ball FBGA (19 × 19) surface-mount package providing a high pin-count solution in a compact footprint.
  • Automotive Qualification and Temperature Range  Automotive grade with AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for demanding environments.
  • Environmental Compliance  RoHS compliant for global environmental and manufacturing requirements.

Typical Applications

  • Automotive Control Modules  Implement vehicle control logic and custom signal processing while leveraging AEC-Q100 qualification and the −40 °C to 125 °C operating range.
  • Embedded System Integration  Use the device’s 39,600 logic elements and 193 I/Os to consolidate functions such as protocol bridging, timing control and peripheral aggregation.
  • On-Chip Data Handling  Utilize approximately 1.16 Mbits of embedded memory for buffering, temporary storage and deterministic on-chip data paths.

Unique Advantages

  • Automotive-Grade Qualification: AEC-Q100 qualification provides a verified foundation for vehicle electronics and related applications.
  • Balanced Logic and Memory: 39,600 logic elements paired with ~1.16 Mbits of RAM supports mid-density, feature-rich designs without immediate need for external memory.
  • High I/O Count in a Compact Package: 193 I/Os in a 324-FBGA (19×19) package allow dense connectivity while conserving board area.
  • Wide Operating Temperature Range: −40 °C to 125 °C supports deployment in harsh and thermally challenging environments.
  • Controlled Core Voltage Range: 1.15–1.25 V supply range simplifies power-rail planning for the programmable core.
  • RoHS Compliant: Meets regulatory requirements for environmentally conscious manufacturing.

Why Choose EP4CE40F19A7N?

The EP4CE40F19A7N positions itself as a mid-density, automotive-qualified FPGA that combines substantial logic resources, embedded memory and a high I/O count in a compact 324-FBGA package. Its electrical and environmental specifications make it suitable for designs that require reliable operation across a wide temperature range and compliance with automotive qualification standards.

This device is well suited for engineers building vehicle electronics or other systems that demand robust, programmable logic with significant on-chip resources and a high pin count. Its combination of logic, memory and automotive qualification supports long-term designs where scalability, integration and environmental robustness are key considerations.

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