EP4CE40F19A7N
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 193 1161216 39600 324-BGA |
|---|---|
| Quantity | 1,285 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BGA | Number of I/O | 193 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2475 | Number of Logic Elements/Cells | 39600 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 1161216 |
Overview of EP4CE40F19A7N – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 193 1161216 39600 324-BGA
The EP4CE40F19A7N is an Intel Cyclone® IV E FPGA offering 39,600 logic elements in a compact 324-ball BGA package. Designed for applications that require mid-density programmable logic, it provides a balance of logic capacity, on-chip memory and I/O in an automotive-qualified device.
Key electrical and environmental characteristics include a nominal core supply range of 1.15–1.25 V, 193 available I/O pins, approximately 1.16 Mbits of embedded memory, and an operating temperature range of −40 °C to 125 °C consistent with its AEC-Q100 qualification.
Key Features
- Core Logic 39,600 logic elements to implement custom digital logic, state machines and glue logic for mid-density designs.
- Embedded Memory Approximately 1.16 Mbits of on-chip RAM to support buffering, FIFOs and local data storage without external memory.
- I/O Capacity 193 user I/O pins for flexible interfacing to peripherals, sensors and external devices.
- Power Operates from a core supply in the 1.15 V to 1.25 V range to match system power-rail planning.
- Package and Mounting 324-ball FBGA (19 × 19) surface-mount package providing a high pin-count solution in a compact footprint.
- Automotive Qualification and Temperature Range Automotive grade with AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C for demanding environments.
- Environmental Compliance RoHS compliant for global environmental and manufacturing requirements.
Typical Applications
- Automotive Control Modules Implement vehicle control logic and custom signal processing while leveraging AEC-Q100 qualification and the −40 °C to 125 °C operating range.
- Embedded System Integration Use the device’s 39,600 logic elements and 193 I/Os to consolidate functions such as protocol bridging, timing control and peripheral aggregation.
- On-Chip Data Handling Utilize approximately 1.16 Mbits of embedded memory for buffering, temporary storage and deterministic on-chip data paths.
Unique Advantages
- Automotive-Grade Qualification: AEC-Q100 qualification provides a verified foundation for vehicle electronics and related applications.
- Balanced Logic and Memory: 39,600 logic elements paired with ~1.16 Mbits of RAM supports mid-density, feature-rich designs without immediate need for external memory.
- High I/O Count in a Compact Package: 193 I/Os in a 324-FBGA (19×19) package allow dense connectivity while conserving board area.
- Wide Operating Temperature Range: −40 °C to 125 °C supports deployment in harsh and thermally challenging environments.
- Controlled Core Voltage Range: 1.15–1.25 V supply range simplifies power-rail planning for the programmable core.
- RoHS Compliant: Meets regulatory requirements for environmentally conscious manufacturing.
Why Choose EP4CE40F19A7N?
The EP4CE40F19A7N positions itself as a mid-density, automotive-qualified FPGA that combines substantial logic resources, embedded memory and a high I/O count in a compact 324-FBGA package. Its electrical and environmental specifications make it suitable for designs that require reliable operation across a wide temperature range and compliance with automotive qualification standards.
This device is well suited for engineers building vehicle electronics or other systems that demand robust, programmable logic with significant on-chip resources and a high pin count. Its combination of logic, memory and automotive qualification supports long-term designs where scalability, integration and environmental robustness are key considerations.
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