EP4CE40F23C6N

The EP4CE40F23C6N is an Intel Cyclone IV E field programmable gate array (FPGA) offered in a 484-ball BGA package. It provides a commercial‑grade, surface‑mount programmable logic solution with a defined core architecture and on‑chip resources suitable for a range of commercial embedded designs.

With 39,600 logic elements and approximately 1.16 Mbits of embedded memory, this device supports complex, I/O‑rich implementations while operating from a 1.15 V to 1.25 V core supply and across a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Logic  39,600 logic elements (LEs) for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 1.16 Mbits of on‑chip RAM to support buffering, state machines, and local data storage.
• I/O Capacity  328 user I/O pins suitable for multi‑interface designs and dense board connectivity.
• Package and Mounting  484‑BGA package (supplier package: 484‑FBGA, 23×23) with surface‑mount mounting type for compact PCB integration.
• Power  Core voltage operating range of 1.15 V to 1.25 V to match specified power rails and design constraints.
• Operating Range  Commercial grade operation from 0 °C to 85 °C.
• Standards Compliance  RoHS compliant.
• Device Documentation  Series datasheet and device handbook detail operating conditions, DC and switching characteristics, supply current, I/O specifications, and other device‑level parameters.

Typical Applications

• Commercial Embedded Systems  Programmable logic for control, customization, and integration in commercial electronic products.
• I/O‑Intensive Designs  Systems that require extensive external connectivity can leverage the device’s 328 I/O pins for sensors, peripherals, and interfaces.
• On‑Chip Memory Dependent Functions  Designs needing local buffering or small data storage can utilize the approximately 1.16 Mbits of embedded RAM.
• Compact Board Designs  BGA packaging supports high‑density PCB layouts where board space is constrained.

Unique Advantages

• Large Logic Capacity: 39,600 logic elements enable implementation of substantial custom digital logic without external glue logic.
• Substantial Embedded Memory: Approximately 1.16 Mbits of on‑chip RAM reduces dependence on external memory for mid‑sized buffering and state storage.
• High I/O Count: 328 I/O pins provide flexibility for multi‑interface and multi‑peripheral designs, simplifying board partitioning.
• Compact BGA Package: 484‑BGA (23×23) supports dense, surface‑mount PCB layouts and reliable solderable assembly.
• Commercial Temperature Rated: Specified for 0 °C to 85 °C operation to match commercial product deployment environments.
• Regulatory Compliance: RoHS compliance supports environmentally constrained product requirements.

Why Choose EP4CE40F23C6N?

The EP4CE40F23C6N positions itself as a robust commercial‑grade Cyclone IV E FPGA option for designers who need a balance of logic density, embedded memory, and extensive I/O in a compact BGA package. Its defined operating voltage range and documented device characteristics allow engineering teams to design to specific electrical and thermal constraints.

This device is well suited to teams developing commercial embedded systems, I/O‑centric modules, and compact boards where on‑chip resources and package density reduce bill‑of‑materials and simplify system integration. Supported series documentation provides the necessary electrical, thermal, and timing specifications for design and verification.

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