EP4CE40F23C8L

IC FPGA 328 I/O 484FBGA
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 328 1161216 39600 484-BGA

Quantity 439 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O328Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2475Number of Logic Elements/Cells39600
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1161216

Overview of EP4CE40F23C8L – Cyclone® IV E Field Programmable Gate Array (FPGA), 484-BGA

The EP4CE40F23C8L is a Cyclone IV E family Field Programmable Gate Array (FPGA) from Intel, supplied in a 484-ball BGA package. It provides a mid-range integration point with 39,600 logic elements, on-chip memory, and a high I/O count for commercial embedded designs.

Designed for applications that require substantial programmable logic, embedded memory, and dense I/O, this device delivers a balance of capacity and integration while operating from a core supply of 0.97 V to 1.03 V within a 0 °C to 85 °C commercial temperature range.

Key Features

  • Logic Capacity — 39,600 logic elements for implementing combinational and sequential logic, state machines, and custom datapaths.
  • Embedded Memory — Approximately 1.16 Mbits of on-chip RAM to support buffering, FIFOs, and small data storage without external memory.
  • I/O Resources — 328 user I/O pins to support parallel interfaces, external buses, and mixed-signal front ends in I/O-intensive designs.
  • Package & Mounting — Available in a 484-BGA package; supplier device package listed as 484-FBGA (23 × 23) and intended for surface-mount assembly.
  • Power Supply — Core voltage supply range specified at 0.970 V to 1.03 V for predictable power domain planning.
  • Operating Range — Commercial-grade device rated for operation from 0 °C to 85 °C to match typical commercial embedded environments.
  • Environmental Compliance — RoHS-compliant for global electronic assembly requirements.

Typical Applications

  • Commercial embedded systems — Implement control logic, protocol handling, and custom hardware acceleration within commercial products.
  • Communication interfaces — Provide glue logic, parallel/serial interface aggregation, and buffering for I/O-dense communication equipment.
  • Prototyping and evaluation — Serve as a programmable platform for proof-of-concept designs and hardware validation that require substantial logic and on-chip memory.
  • Custom digital processing — Host bespoke datapath implementations, finite-state controllers, and peripheral bridging where integrated memory and I/O matter.

Unique Advantages

  • Significant logic capacity: 39,600 logic elements enable complex digital functions and multiple concurrent logic blocks in a single device.
  • On-chip RAM reduces external BOM: Approximately 1.16 Mbits of embedded memory lowers reliance on external memory for buffering and small data storage.
  • High I/O count for flexible interfacing: 328 I/Os support diverse peripheral connections and bus interfaces without external expanders.
  • Compact BGA packaging: 484-BGA (484-FBGA, 23 × 23) provides a dense footprint for space-constrained commercial PCBs while supporting surface-mount assembly.
  • Commercial temperature suitability: Rated 0 °C to 85 °C to match typical commercial application thermal environments.
  • RoHS compliance: Meets RoHS environmental requirements for modern electronic manufacturing.

Why Choose EP4CE40F23C8L?

The EP4CE40F23C8L positions itself as a practical, mid-capacity Cyclone IV E FPGA option for commercial designs that need a balance of programmable logic, embedded memory, and extensive I/O. With 39,600 logic elements, roughly 1.16 Mbits of on-chip RAM, and 328 I/Os in a 484-BGA surface-mount package, it supports compact, integrated implementations of custom digital logic and interface functions.

This part is suitable for engineers and teams building commercial embedded systems, communication interface logic, and hardware prototypes that benefit from on-chip resources and a predictable voltage and temperature operating envelope. Its RoHS compliance and standard BGA package help integrate the device into established manufacturing workflows.

Request a quote or submit an inquiry for pricing and availability of EP4CE40F23C8L to begin integration into your next commercial FPGA design.

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